Effect of trace Zn addition on electromigration of Cu/Sn–10Bi/Cu solder joints

IF 2.5 2区材料科学

Journal of Iron and Steel Research International Pub Date : 2024-08-12 DOI:10.1007/s42243-024-01301-7

Jia-yu Zhang, Feng-jiang Wang, Yan-xin Qiao

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Abstract

The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds (IMCs) under electromigration. The electromigration test was realized on Cu/solder/Cu linear specimens at a current density of 1.0 × 10⁴ A/cm² with different stressing time. It was found that Bi atoms in Cu/Sn–10Bi/Cu solder joint were driven towards anode side under current driving force and then accumulated at anode interface with current stressing time increasing. The thickness and growth rate of Cu₆Sn₅ IMCs at anode interface were obviously larger than those at cathode side due to polarity effect. The addition of 0.2 wt.% Zn inhibited the migration of Bi atoms during the electromigration process, and the composition of interfacial IMCs was transformed into Cu₆(Sn, Zn)₅, which played as a diffusion barrier to effectively reduce the asymmetric growth of IMCs and the consumption of Cu substrate during electromigation.

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添加微量锌对 Cu/Sn-10Bi/Cu 焊点电迁移的影响

研究了 Sn-10Bi 焊点的电迁移可靠性，并尝试在焊料中添加微量锌，通过抑制电迁移下界面金属间化合物（IMC）的生长来改善其性能。在电流密度为 1.0 × 104 A/cm2 且应力时间不同的情况下，对铜/焊料/铜线性试样进行了电迁移测试。结果发现，在电流驱动力的作用下，Cu/Sn-10Bi/Cu 焊点中的铋原子被驱向阳极一侧，然后随着电流应力时间的增加而在阳极界面聚集。由于极性效应，阳极界面上 Cu6Sn5 IMC 的厚度和生长速度明显大于阴极侧。0.2 wt.% Zn 的加入抑制了电迁移过程中 Bi 原子的迁移，界面 IMC 的组成转变为 Cu6（Sn，Zn）5，起到了扩散屏障的作用，有效地减少了 IMC 的不对称生长和电迁移过程中对 Cu 基底的消耗。

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来源期刊

Journal of Iron and Steel Research International 工程技术-冶金工程

自引率

16.00%

发文量

161

审稿时长

2.8 months

期刊介绍： Publishes critically reviewed original research of archival significance Covers hydrometallurgy, pyrometallurgy, electrometallurgy, transport phenomena, process control, physical chemistry, solidification, mechanical working, solid state reactions, materials processing, and more Includes welding & joining, surface treatment, mathematical modeling, corrosion, wear and abrasion Journal of Iron and Steel Research International publishes original papers and occasional invited reviews on aspects of research and technology in the process metallurgy and metallic materials. Coverage emphasizes the relationships among the processing, structure and properties of metals, including advanced steel materials, superalloy, intermetallics, metallic functional materials, powder metallurgy, structural titanium alloy, composite steel materials, high entropy alloy, amorphous alloys, metallic nanomaterials, etc..

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