Topology optimization of anisotropic multi-material structures considering negative Poisson’s ratio and high thermal conductivity based on IGA approach

IF 2.7 3区 材料科学 Q2 ENGINEERING, MECHANICAL
Jianping Zhang, Yi Qiu, Cheng Xu, Haiming Zhang, Jiangpeng Peng, Zhijian Zuo
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Abstract

A multi-objective topological optimization model is proposed for anisotropic multi-material microstructures with negative Poisson’s ratio (NPR) and high thermal conductivity using isogeometric analysis (IGA) approach and alternating active phases algorithm. The effective elasticity matrix and heat conductivity matrix are calculated to represent the metamaterial and thermal conduction properties of the microstructures, respectively. The weighting factor is defined to adjust the proportion of NPR and heat transfer performance in the optimization objective. The validity of the proposed model is confirmed by structural performance analysis. Additionally, the IGA-based optimal topological structures, which have continuous boundary and low intermediate density without sensitivity filtering, have been produced using 3D printing. The effects of weighting factor, the number of material types, and anisotropic parameters on the optimal topological structures and properties are investigated. Either increasing the weighting factor or upgrading to more materials with superior properties can boost the thermal conductivity of the microstructure. Compared to isotropic multi-material microstructures, it is recommended that the range for Poisson’s ratio factor, heat conductivity factor be 1–1.5 and 1.25–1.5 to enhance the performance of microstructures, respectively.

Abstract Image

基于 IGA 方法对考虑负泊松比和高导热性的各向异性多材料结构进行拓扑优化
针对各向异性的负泊松比(NPR)和高导热性多材料微结构,采用等几何分析(IGA)方法和交替活跃相算法,提出了一种多目标拓扑优化模型。计算出的有效弹性矩阵和导热矩阵分别代表了微结构的超材料和热传导特性。定义了权重系数,以调整优化目标中 NPR 和传热性能的比例。结构性能分析证实了所提模型的有效性。此外,还利用三维打印技术制作了基于 IGA 的最优拓扑结构,该结构具有连续边界和低中间密度,无需灵敏度过滤。研究了加权因子、材料类型数量和各向异性参数对最优拓扑结构和性能的影响。无论是增加加权系数还是升级到更多具有优异性能的材料,都能提高微结构的导热性。与各向同性多材料微结构相比,建议泊松比系数和导热系数的范围分别为 1-1.5 和 1.25-1.5,以提高微结构的性能。
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来源期刊
International Journal of Mechanics and Materials in Design
International Journal of Mechanics and Materials in Design ENGINEERING, MECHANICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
6.00
自引率
5.40%
发文量
41
审稿时长
>12 weeks
期刊介绍: It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design. Analytical synopsis of contents: The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design: Intelligent Design: Nano-engineering and Nano-science in Design; Smart Materials and Adaptive Structures in Design; Mechanism(s) Design; Design against Failure; Design for Manufacturing; Design of Ultralight Structures; Design for a Clean Environment; Impact and Crashworthiness; Microelectronic Packaging Systems. Advanced Materials in Design: Newly Engineered Materials; Smart Materials and Adaptive Structures; Micromechanical Modelling of Composites; Damage Characterisation of Advanced/Traditional Materials; Alternative Use of Traditional Materials in Design; Functionally Graded Materials; Failure Analysis: Fatigue and Fracture; Multiscale Modelling Concepts and Methodology; Interfaces, interfacial properties and characterisation. Design Analysis and Optimisation: Shape and Topology Optimisation; Structural Optimisation; Optimisation Algorithms in Design; Nonlinear Mechanics in Design; Novel Numerical Tools in Design; Geometric Modelling and CAD Tools in Design; FEM, BEM and Hybrid Methods; Integrated Computer Aided Design; Computational Failure Analysis; Coupled Thermo-Electro-Mechanical Designs.
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