Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards
Kwang-Woo Kim, Jae-Hyeon Park, Tae-Yong Park, Hyun-Ung Oh
{"title":"Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards","authors":"Kwang-Woo Kim, Jae-Hyeon Park, Tae-Yong Park, Hyun-Ung Oh","doi":"10.3390/aerospace11070562","DOIUrl":null,"url":null,"abstract":"The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.","PeriodicalId":48525,"journal":{"name":"Aerospace","volume":null,"pages":null},"PeriodicalIF":2.1000,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Aerospace","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/aerospace11070562","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, AEROSPACE","Score":null,"Total":0}
引用次数: 0
Abstract
The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.
期刊介绍:
Aerospace is a multidisciplinary science inviting submissions on, but not limited to, the following subject areas: aerodynamics computational fluid dynamics fluid-structure interaction flight mechanics plasmas research instrumentation test facilities environment material science structural analysis thermophysics and heat transfer thermal-structure interaction aeroacoustics optics electromagnetism and radar propulsion power generation and conversion fuels and propellants combustion multidisciplinary design optimization software engineering data analysis signal and image processing artificial intelligence aerospace vehicles'' operation, control and maintenance risk and reliability human factors human-automation interaction airline operations and management air traffic management airport design meteorology space exploration multi-physics interaction.