Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards

IF 2.1 3区 工程技术 Q2 ENGINEERING, AEROSPACE
Kwang-Woo Kim, Jae-Hyeon Park, Tae-Yong Park, Hyun-Ung Oh
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Abstract

The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.
基于应变的印刷电路板方法在采用垂直安装印刷电路板的空载电子设备中的有效性实验评估
Oh-Park 方法是为了克服斯坦伯格理论在评估空间电子设备结构安全方面的局限性而提出的,并已在印刷电路板(PCB)试样层面上对各种类型的电子封装(如球栅阵列(BGA)、柱栅阵列(CGA)和小型外线封装(SOP))进行了实验验证。然而,由于安装在外壳上的印刷电路板会受到机械外壳弹性模式的影响,因此有必要对设计方法进行验证。此外,虽然基于临界应变的现有理论的有效性已在水平安装结构中得到验证,但也有 PCB 垂直安装的情况。因此,有必要考虑安装电子元件的边界条件的动态影响。本研究制作了具有相应边界条件的电子元件试样,并进行了疲劳寿命测试。此外,还使用斯坦伯格理论和 Oh-Park 方法进行了结构分析,并将分析结果与疲劳寿命测试结果进行了比较。结果表明,使用 Oh-Park 方法进行的分析准确地反映了测试结果,并通过实验验证了 Oh-Park 方法在垂直电子设备中的有效性。
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来源期刊
Aerospace
Aerospace ENGINEERING, AEROSPACE-
CiteScore
3.40
自引率
23.10%
发文量
661
审稿时长
6 weeks
期刊介绍: Aerospace is a multidisciplinary science inviting submissions on, but not limited to, the following subject areas: aerodynamics computational fluid dynamics fluid-structure interaction flight mechanics plasmas research instrumentation test facilities environment material science structural analysis thermophysics and heat transfer thermal-structure interaction aeroacoustics optics electromagnetism and radar propulsion power generation and conversion fuels and propellants combustion multidisciplinary design optimization software engineering data analysis signal and image processing artificial intelligence aerospace vehicles'' operation, control and maintenance risk and reliability human factors human-automation interaction airline operations and management air traffic management airport design meteorology space exploration multi-physics interaction.
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