Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni–P plating

IF 2.4 4区工程技术 Q3 ELECTROCHEMISTRY

Journal of Applied Electrochemistry Pub Date : 2024-07-22 DOI:10.1007/s10800-024-02177-x

Guanqun Hu, Rupeng Li, Wanda Liao, Changning Bai, Xingkai Zhang, Qiuping Zhao, Junyan Zhang

引用次数: 0

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用电镀置换法在铜上制备钴层，以替代钯来激活化学镍-P 镀层

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Applied Electrochemistry 工程技术-电化学

CiteScore

4.70

自引率

3.40%

发文量

133

审稿时长

2.9 months

期刊介绍： The Journal of Applied Electrochemistry is the leading journal on technologically orientated aspects of electrochemistry. The interface between electrochemical science and engineering is highlighted, emphasizing the application of electrochemistry to technological development and practice, and documenting properties and data of materials; design factors, design methodologies, scale-up, economics and testing of electrochemical devices and processes. The broad range of technologies includes energy conversion, conservation, and storage, new battery systems, fuel cells, super capacitors, solar cells, power delivery, industrial synthesis, environmental remediation, cell design, corrosion, electrochemical reaction engineering, medical applications of electrochemistry and bio-electrochemistry, the electrochemical treatment of effluents, hydrometallurgy, molten salt and solid state electrochemistry, surface finishing, electroplating, electrodeposition, sensors, and applications of molecular electrochemistry. It also publishes invited reviewed articles, book reviews and news items and a comprehensive electrochemical events calendar.