Influence of Graphene on Sheet Resistivity and Urbach Enery of Nano TiO2 for DSSC Electrode

G. Riungu, Simon Mugo, James Ngaruyia, Leonard Gitu
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Abstract

Importance of renewable energy cannot be over emphasized. Titanium IV oxide (TiO2) is the most suitable semiconductor for dye sensitized solar cell (DSSC) due to its chemical stability, non toxicity and excellent optoelectronic properties. In this research TiO2 is coated on graphene to enhance its charge transport aiming to reduce recombination which is a main set back in DSSCs. undestanding graphene- TiO2 contact is therefore essential for DSSC application. TiO2 thin films were deposited on single layer graphene (SLG) as well as on flourine tin oxide (FTO) using doctor blading technique. The films were annealed at rates of 2°C /min and 1°C/min up to a temperature of 450°C followed by sintering at this temperature for 30 minutes. Four point probe SRM-232 was used to measure sheet resistance of the samples. The film thickness were obtained from transmittance using pointwise unconstrained minimization approximation (PUMA). UV –VIS spectrophotometer was employed to measure transmittance. Resistivity of TiO2 on both FTO and Graphene were of order 10-4 Ωcm. However, TiO2 annealed on graphene matrix exhibited a slightly lower resistivity 5.6 x10-4 Ωcm as compared to 6.0x10-4 Ωcm on FTO. Optical transmittance on visible region was lower for TiO2 on FTO than on SLG, 71.48% and 80.11% respectively. Urbach energy (Eu) for weak absorption region decreased with annealing rate. Urbach energies for 1°C/min TiO2 on FTO and SLG were 361 meV and 261meV respectively. This was used to account for decrease of disoders of films due to annealing. A striking relation between sheet resistivity and urbach was reported suggesting SLG as a suitable candidate for photoanode of a DSSC.
石墨烯对用于 DSSC 电极的纳米 TiO2 薄膜电阻率和乌巴赫能的影响
可再生能源的重要性怎么强调都不为过。钛四氧化物(TiO2)具有化学稳定性、无毒性和出色的光电特性,是最适合用于染料敏化太阳能电池(DSSC)的半导体。在这项研究中,TiO2 被涂覆在石墨烯上,以增强其电荷传输,从而减少重组,而重组是 DSSC 的主要障碍。使用刮刀技术在单层石墨烯(SLG)和氧化锡(FTO)上沉积了二氧化钛薄膜。薄膜以 2°C /min 和 1°C /min 的速度退火至 450°C,然后在此温度下烧结 30 分钟。使用四点探针 SRM-232 测量样品的薄层电阻。利用点式无约束最小化近似法 (PUMA) 从透射率得出薄膜厚度。紫外可见分光光度计用于测量透射率。FTO 和石墨烯上的二氧化钛电阻率均为 10-4 Ωcm。然而,在石墨烯基体上退火的二氧化钛的电阻率为 5.6 x10-4 Ωcm,略低于在 FTO 上的 6.0x10-4Ωcm。FTO 上的 TiO2 在可见光区域的透光率低于 SLG,分别为 71.48% 和 80.11%。弱吸收区的乌巴赫能(Eu)随退火速率的增加而降低。FTO 和 SLG 上 1°C/min 的 TiO2 的 Urbach 能量分别为 361 meV 和 261meV。这就是退火导致薄膜二极体减少的原因。薄膜电阻率与乌尔巴赫之间的显著关系表明,SLG 是 DSSC 光阳极的合适候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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