Pattern recognition in electromechanical impedance spectroscopy damage detection of adhesive joints using multidimensional scaling

A. Francisco, G. Tenreiro, António M Lopes, Lucas FM da Silva
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Abstract

Adhesive joints are prone to various types of damage sources, which may not be identifiable with current non-destructive tests (NDTs). Structural health monitoring techniques, such as those based on electromechanical impedance spectroscopy (EMIS), aim to outperform NDTs in damage detection, by continuously monitoring structures. Although the EMIS-based algorithmic performance of damage detection has been evaluated on metallic and composite components, integrity monitoring of adhesive joints is yet to be fully determined. Therefore, this article investigates the use of multidimensional scaling (MDS) to cluster and visualize experimental impedance measurements of bonded joints in a three dimensional space. With these results, an Euclidean distance damage metric is used to try and classify the type of damage. The results show that damage detection is easily performed with the MDS algorithm, but effectiveness is dependent on the spectral measurement conditions. Furthermore, reduced dimensional spaces can yield information regarding the size and location of the damage in the adhesive layer, yielding increased knowledge on the integrity of structural adhesive joints.
利用多维标度在粘合剂接头的机电阻抗谱损伤检测中进行模式识别
粘合接头容易受到各种类型损伤源的影响,而目前的无损检测(NDT)可能无法识别这些损伤源。结构健康监测技术,如基于机电阻抗谱(EMIS)的技术,旨在通过持续监测结构,在损伤检测方面超越无损检测。虽然基于 EMIS 的损伤检测算法性能已在金属和复合材料部件上进行了评估,但对粘合剂接头的完整性监测尚未完全确定。因此,本文研究了使用多维缩放(MDS)在三维空间中对粘接接头的实验阻抗测量结果进行聚类和可视化。根据这些结果,使用欧氏距离损伤度量法尝试对损伤类型进行分类。结果表明,使用 MDS 算法很容易进行损坏检测,但有效性取决于频谱测量条件。此外,缩小维度空间可以获得有关粘合剂层损伤大小和位置的信息,从而增加对结构粘合剂接头完整性的了解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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