Influence of sodium chloride on corrosion resistance of ever silver vessels in the presence of curd rice

Thangarajan Umamathi, Venkatachalam Prathipa, Arockiam Roslin, Arockiaraj Little Jewelcy, Micheal Velankanni Jeevithe Clara, Nilavan Anitha, Mohamed Ibrahim Nasrin Sahana, Rajendran Susai, Arjunan Krishnaveni
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Abstract

The present work is undertaken to investigate the corrosion resistance of ever silver in the presence of water, water+curd system, water+curd+rice system, water+curd+rice+Salt system. The corrosion resistance has been evaluated by AC impedance spectra . AC impedance spectra have been employed to investigate the corrosion resistance of ever silver electrode when it is immersed in various test solutions like water, curd, curd rice recipe, curd rice recipe with salt (sodium chloride 500 ppm). The corrosion resistance of ever silver electrode when it is immersed in various test solutions like water, water+curd, water+curd+rice and water+curd+rice+salt have been evaluated by AC impedance spectroscopy. If a protective film is formed, the charge transfer resistance increases, impedance value increases, phase angle value increases and double layer capacitance (Cdl) value decreases. When Ever silver electrode is immersed in water + curd rice system + 500ppmsodium chloride system, the corrosion resistance of ever silver electrode decreases. This is due to the presence of chloride ion introduced into the curd rice system. It implies that when curd rice is packed in vessels made of ever silver, we should avoid adding salt to the curd rice. It is better to keep the salt and curd rice separately. It is to be noted that this corrosion resistance is better than the corrosion resistance in water alone. The corrosion resistance decreases in the following order: Water + Curd + Rice system > Water + Curd + Rice + Salt system (sodium chloride 500ppm) > Water+ Curd system > Water
氯化钠对有凝乳米存在的银制容器耐腐蚀性的影响
本研究旨在探讨银在水、水+腐乳体系、水+腐乳+大米体系、水+腐乳+大米+盐体系中的抗腐蚀性。耐腐蚀性通过交流阻抗光谱进行评估。交流阻抗光谱用于研究银电极浸入各种测试溶液(如水、凝乳、凝乳米配方、凝乳米配方加盐(氯化钠 500 ppm))时的耐腐蚀性。通过交流阻抗光谱法评估了银电极浸入水、水+凝乳、水+凝乳+大米和水+凝乳+大米+盐等各种测试溶液时的耐腐蚀性。如果形成了保护膜,电荷转移电阻会增加,阻抗值会增加,相位角值会增加,双层电容 (Cdl) 值会降低。当 Ever 银电极浸入水+凝乳米体系+500ppms 氯化钠体系时,银电极的耐腐蚀性会降低。这是由于凝乳米体系中引入了氯离子。这意味着,在用恒银制成的容器包装凝乳米时,应避免在凝乳米中加盐。最好将盐和咖喱饭分开保存。值得注意的是,这种耐腐蚀性优于单独在水中的耐腐蚀性。耐腐蚀性按以下顺序递减:水+凝乳+大米系统 > 水+凝乳+大米+盐系统(氯化钠 500ppm) > 水+凝乳系统 > 水
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来源期刊
Zastita materijala
Zastita materijala Materials Science-General Materials Science
CiteScore
0.80
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0.00%
发文量
26
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