Operation optimization of prefabricated light modular radiant heating system: Thermal resistance analysis and numerical study

IF 3.7 2区材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING

Journal of Central South University Pub Date : 2024-07-23 DOI:10.1007/s11771-024-5696-2

Yao Li, Ru-kun Hu, Li Xin, Jie Xue, Fei Huang, Jian-wei Xia, Xiao-hu Yang

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引用次数: 0

Abstract

The utilization of prefabricated light modular radiant heating system has demonstrated significant increases in heat transfer efficiency and energy conservation capabilities. Within prefabricated building construction, this new heating method presents an opportunity for the development of comprehensive facilities. The parameters for evaluating the effectiveness of such a system are the upper surface layer’s heat flux and temperature. In this paper, thermal resistance analysis calculation based on a simplified model for this unique radiant heating system analysis is presented with the heat transfer mechanism’s evaluation. The results obtained from thermal resistance analysis calculation and numerical simulation indicate that the thermal resistance analysis method is highly accurate with temperature discrepancies ranging from 0.44 °C to −0.44 °C and a heat flux discrepancy of less than 7.54%, which can meet the requirements of practical engineering applications, suggesting a foundation for the prefabricated radiant heating system

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预制轻型模块辐射供暖系统的运行优化：热阻分析和数值研究

预制轻型模块辐射供暖系统的使用表明，其传热效率和节能能力显著提高。在预制建筑结构中，这种新型加热方法为综合设施的发展提供了机遇。评估这种系统有效性的参数是上表面层的热通量和温度。本文介绍了基于简化模型的热阻分析计算，对这种独特的辐射供暖系统进行了分析，并对传热机制进行了评估。热阻分析计算和数值模拟的结果表明，热阻分析方法的精确度很高，温度偏差在 0.44 ℃ 至 -0.44 ℃ 之间，热通量偏差小于 7.54%，能够满足实际工程应用的要求，为预制辐射供暖系统奠定了基础。

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来源期刊

Journal of Central South University METALLURGY & METALLURGICAL ENGINEERING-

CiteScore

6.10

自引率

6.80%

发文量

242

审稿时长

2-4 weeks

期刊介绍： Focuses on the latest research achievements in mining and metallurgy Coverage spans across materials science and engineering, metallurgical science and engineering, mineral processing, geology and mining, chemical engineering, and mechanical, electronic and information engineering