Aaron J Yeiser, Emma F Wawrzynek, John Z Zhang, Lukas Graf, Christopher I McHugh, Ioannis Kymissis, Elizabeth S Olson, Jeffrey H Lang and Hideko Heidi Nakajima
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引用次数: 0
Abstract
Objective. We present the ‘UmboMic,’ a prototype piezoelectric cantilever microphone designed for future use with totally-implantable cochlear implants. Methods. The UmboMic sensor is made from polyvinylidene difluoride (PVDF) because of its low Young’s modulus and biocompatibility. The sensor is designed to fit in the middle ear and measure the motion of the underside of the eardrum at the umbo. To maximize its performance, we developed a low noise charge amplifier in tandem with the UmboMic sensor. This paper presents the performance of the UmboMic sensor and amplifier in fresh cadaveric human temporal bones. Results. When tested in human temporal bones, the UmboMic apparatus achieves an equivalent input noise of 32.3 dB SPL over the frequency range 100 Hz–7 kHz, good linearity, and a flat frequency response to within 10 dB from about 100 Hz–6 kHz. Conclusion. These results demonstrate the feasibility of a PVDF-based microphone when paired with a low-noise amplifier. The reported UmboMic apparatus is comparable in performance to a conventional hearing aid microphone. Significance. The proof-of-concept UmboMic apparatus is a promising step towards creating a totally-implantable cochlear implant. A completely internal system would enhance the quality of life of cochlear implant users.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.