Investigation on the Thermal and Wettability Properties Aided with Mechanical Test Simulation of Tin (Sn) - Bismuth (Bi) Solder Alloy at Low Reflow Temperatures

Key Engineering Materials Pub Date : 2024-07-03 DOI:10.4028/p-aVXW5D

Noor Elyna Ezette Anuar, Amares Singh, Michelle Leong Mei Kit, Hui Leng Choo, Rajkumar Durairaj, S. Janasekaran

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Abstract

The current study proposes to investigate the thermal, wettability and mechanical properties of a low temperature SnBi solder. The main aim is to investigate the performance of the SnBi solder alloy with different Bi composition. The study also establishes the relationship between melting temperature, spreading area and tensile stress of the SnBi with different Bi composition at different low reflow temperatures. The thermal and wettability tests are conducted experimentally, while the mechanical test will be analysed via finite element analyses (FEA). The single shear lap test method was adopted for the simulation. The thermal properties of the SnBi solder are investigated using the differential scanning calorimeter (DSC). The reflow temperature selected ranges from 160 °C to 220 °C to accommodate the purpose of low temperature soldering. Wetting test results showed that spreading area of Sn48Bi solder alloy increased to 28.1 and 42.88 at 180 °C and 210 °C respectively. The increase in the Bi composition reduced the tensile strength regardless of the increase of the reflow temperature. The preliminary results commend the characteristics of the SnBi solder as a possible alternative to the Pb solder.

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低回流焊温度下锡（Sn）-铋（Bi）焊料合金机械测试模拟辅助下的热性能和润湿性能研究

目前的研究提议调查低温锡铋焊料的热性能、润湿性能和机械性能。主要目的是研究不同 Bi 成分的锡铋焊料合金的性能。研究还确定了在不同的低回流温度下，不同铋成分的铋硒焊料的熔化温度、铺展面积和拉伸应力之间的关系。热测试和润湿性测试通过实验进行，而机械测试将通过有限元分析（FEA）进行分析。模拟采用了单剪切搭接试验方法。使用差示扫描量热仪（DSC）研究了铋锡焊料的热性能。为满足低温焊接的目的，选择的回流焊温度范围为 160 °C 至 220 °C。润湿测试结果表明，在 180 ℃ 和 210 ℃ 时，Sn48Bi 焊料合金的铺展面积分别增加到 28.1 和 42.88。无论回流焊温度如何升高，铋成分的增加都会降低拉伸强度。初步结果表明，锡铋焊料具有可替代铅焊料的特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Key Engineering Materials

CiteScore

1.00

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0.00%

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