MoS2-assisted growth of highly-oriented AlN thin films by low-temperature van der Waals epitaxy

J. Patouillard, M. Bernard, S. Cadot, R. Gassilloud, N. Bernier, A. Grenier, A. Mantoux, E. Blanquet, F. Martin, C. Raynaud, F. Gianesello
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Abstract

Aluminum nitride (AlN) is a wide bandgap material used in acoustic devices, piezo- micro-electromechanical system and is promising for other electronic applications. However, for most applications, the AlN crystalline quality obtained by PVD or MOCVD is insufficient, and suitable growth substrates providing an adapted lattice match and coefficient of thermal expansion are limited. Alternatively, monocrystalline AlN wafers are not yet available in 200/300 mm sizes and suffer from high costs and quality issues. Here, we propose a novel approach involving a two-dimensional transition metal dichalcogenide (TMD) material as a seed layer, which displays an excellent lattice matching with AlN (>98%) allowing a strong enhancement in the c axis texture of sputtered AlN layers on Si(100)/SiO2 thermal oxide (500 nm) substrates. We have successfully demonstrated an eightfold improvement of the AlN (002) rocking curve compared to reference samples grown on thermal SiO2, thus providing a relevant and cost-effective process for the large-scale deployment of high-quality III-N materials on silicon-based substrates.
通过低温范德华外延生长 MoS2- 辅助的高取向 AlN 薄膜
氮化铝(AlN)是一种宽带隙材料,可用于声学设备、压电-微机电系统,在其他电子应用领域也大有可为。然而,对于大多数应用来说,通过 PVD 或 MOCVD 获得的氮化铝结晶质量不够好,而且能提供合适的晶格匹配和热膨胀系数的生长基底也很有限。另外,目前还没有 200/300 毫米尺寸的单晶氮化铝晶片,而且成本高、质量差。在此,我们提出了一种以二维过渡金属二掺杂物 (TMD) 材料为种子层的新方法,这种材料与氮化铝的晶格匹配度极佳(大于 98%),可显著增强 Si(100)/SiO2 热氧化物(500 nm)基底上溅射氮化铝层的 c 轴纹理。与在热二氧化硅上生长的参考样品相比,我们成功地将 AlN (002) 的摇摆曲线提高了八倍,从而为在硅基衬底上大规模部署高质量 III-N 材料提供了一种相关且具有成本效益的工艺。
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