Innovation in Knowledge Economy: A Case Study of 3D Printing's Rise in Global Markets and India

Q3 Computer Science
Aman Semalty, R. Agrawal
{"title":"Innovation in Knowledge Economy: A Case Study of 3D Printing's Rise in\nGlobal Markets and India","authors":"Aman Semalty, R. Agrawal","doi":"10.2174/0126662558304420240705114015","DOIUrl":null,"url":null,"abstract":"\n\n3D printing is a rapidly growing technology with features of enhanced\ncustomizability, reduced errors, zero material waste, reduced costs, and quick turnaround\ntimes. In this work, the data were collected from the Derwent Innovation and Web of Science\ndatabases for patent and publication search, respectively.\n\n\n\nThe results were critically\nanalysed and correlated with the global and Indian market growth. USA (with 5 out of the top\nten patent contributing companies), China, Germany, France, and Taiwan were determined to\nbe the top countries with the maximum number of patents on 3D printing technology. Both patents and publications exhibited consistent growth until 2011. From 2012 onwards, the rate of\npatent filings began to surpass that of academic publications, indicating a shift in the dynamics.\n\n\n\nThis trend has continued over the years, leading to a notable difference between the\nnumber of patents (19,322) and publications (10,571) in the year 2022. India has been found to\nrank 8th in 3D printing innovation and research, globally.\n\n\n\nIn this study, the global\nand Indian market growth has been observed and the opportunities and challenges for the Indian market have been critically studied.\n","PeriodicalId":36514,"journal":{"name":"Recent Advances in Computer Science and Communications","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Recent Advances in Computer Science and Communications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2174/0126662558304420240705114015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Computer Science","Score":null,"Total":0}
引用次数: 0

Abstract

3D printing is a rapidly growing technology with features of enhanced customizability, reduced errors, zero material waste, reduced costs, and quick turnaround times. In this work, the data were collected from the Derwent Innovation and Web of Science databases for patent and publication search, respectively. The results were critically analysed and correlated with the global and Indian market growth. USA (with 5 out of the top ten patent contributing companies), China, Germany, France, and Taiwan were determined to be the top countries with the maximum number of patents on 3D printing technology. Both patents and publications exhibited consistent growth until 2011. From 2012 onwards, the rate of patent filings began to surpass that of academic publications, indicating a shift in the dynamics. This trend has continued over the years, leading to a notable difference between the number of patents (19,322) and publications (10,571) in the year 2022. India has been found to rank 8th in 3D printing innovation and research, globally. In this study, the global and Indian market growth has been observed and the opportunities and challenges for the Indian market have been critically studied.
知识经济中的创新:3D 打印技术在全球市场和印度崛起的案例研究
三维打印是一项快速发展的技术,具有增强可定制性、减少误差、零材料浪费、降低成本和快速周转时间等特点。在这项工作中,我们分别从 Derwent Innovation 和 Web of Scienced 数据库中收集了专利和出版物检索数据。美国(在贡献专利最多的十家公司中有五家)、中国、德国、法国和中国台湾被确定为拥有最多 3D 打印技术专利的国家。直到 2011 年,专利和出版物都呈现出持续增长的态势。从 2012 年起,专利申请率开始超过学术论文发表率,这表明动态发生了变化。这一趋势持续了数年,到 2022 年,专利数量(19,322 项)和论文发表数量(10,571 篇)之间将出现显著差异。本研究观察了全球和印度市场的增长情况,并对印度市场面临的机遇和挑战进行了深入研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Recent Advances in Computer Science and Communications
Recent Advances in Computer Science and Communications Computer Science-Computer Science (all)
CiteScore
2.50
自引率
0.00%
发文量
142
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