Staggered band alignment of n-Er2O3/p-Si heterostructure for the fabrication of a high-performance broadband photodetector

Anupam Ghosh, Riya Wadhwa, Shivani, Sonia Deswal, Pradeep Kumar and Mukesh Kumar
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Abstract

The low responsivity of conventional Silicon photodiodes in ultraviolet and near-infrared regimes restricts their utility as broadband photodetectors (BBPDs). Despite ongoing investigations into various p-n heterostructures for Silicon-based BBPDs, challenges such as high dark current (Idark), low collection efficiency, low detectivity, and compatibility issues with large-scale Silicon-based devices persist. In this context, we have fabricated relatively unexplored n-Er2O3/p-Si heterojunction-based BBPDs. Polycrystalline Er2O3 thin films (∼110 nm) were deposited on p-Si 〈100〉 substrates by radio frequency magnetron sputtering. Although this process induces a microstrain of approximately 0.022 and a dislocation density of about 0.00303/nm2, the presence of optically active defects is minimal, indicated by a low Urbach energy (∼0.35 eV). X-ray photoelectron spectroscopy (XPS) analysis confirms staggered band alignment at the heterointerface, facilitating efficient charge carrier separation and transport. Consequently, the In/p-Si/n-Er2O3/In device demonstrated significant BBPD properties– low Idark ∼0.15 μA (at +5 V), photo-to-dark current ratio (PDCR) ∼6.5 (at +5 V, 700 nm) with a maximum photoresponsivity ∼22.3 A W−1, and impressive detectivity (∼1013 Jones) even in UV-C region where traditional silicon-based photodetectors respond feebly. The device also demonstrates transient photo-response across an ultrawide spectrum (254 nm–1200 nm) with a fast rise time/fall time ∼79 ms/∼86 ms (at −5 V for 600 nm illumination). This work establishes a straightforward and reliable method for proper material engineering, surface texturing, staggered heterojunction formation, and high-performance BBPD fabrication with prominent broad-spectrum responsivity, sizeable detectivity, and fast response. The integration of these BBPDs with Silicon opens possibilities for their use in electronic devices containing optical switches for communications and broadband image sensors, enhancing their utility in various applications.
用于制造高性能宽带光电探测器的 n-Er2O3/p-Si 异质结构的交错能带排列
传统硅光电二极管在紫外和近红外波段的响应率较低,限制了其作为宽带光电探测器(BBPD)的应用。尽管目前正在对硅基 BBPD 的各种 p-n 异质结构进行研究,但高暗电流(Idark)、低收集效率、低检测率以及与大规模硅基器件的兼容性问题等挑战依然存在。在这种情况下,我们制造出了相对尚未开发的 n-Er2O3/p-Si 异质结 BBPD。我们采用射频磁控溅射技术在对硅 〈100〉基板上沉积了多晶 Er2O3 薄膜(110 nm)。虽然这一过程会导致约 0.022 的微应变和约 0.00303/nm2 的位错密度,但光学活性缺陷的存在却微乎其微,这体现在较低的厄巴赫能(∼0.35 eV)上。X 射线光电子能谱(XPS)分析证实了异质界面的交错能带排列,有利于电荷载流子的有效分离和传输。因此,In/p-Si/n-Er2O3/In 器件具有显著的 BBPD 特性--低 Idark ∼ 0.15 μA(+5 V 时),光暗电流比 (PDCR) ∼ 6.5(+5 V,700 nm 时),最大光致发光率 ∼ 22.3 A W-1,即使在传统硅基光电探测器反应微弱的 UV-C 区域也具有令人印象深刻的检测率(∼1013 Jones)。该器件还在超宽光谱(254 nm-1200 nm)范围内实现了瞬态光反应,上升时间/下降时间快达 ∼79 ms/∼86 ms(在 -5 V、600 nm 照明条件下)。这项工作为适当的材料工程、表面纹理、交错异质结的形成和高性能 BBPD 的制造提供了一种简单可靠的方法,具有突出的宽光谱响应性、可观的检测能力和快速响应。这些 BBPD 与硅的集成为将其用于包含通信光开关和宽带图像传感器的电子设备提供了可能性,从而提高了它们在各种应用中的实用性。
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