Structural design and simulation of PDMS/SiC functionally graded substrates for applications in flexible hybrid electronics

IF 4.2 2区 工程技术 Q2 ENGINEERING, MANUFACTURING
Jian-Jun Yang, Yin-Bao Song, Zheng-Hao Li, Luo-Wei Wang, Shuai Shang, Hong-Ke Li, Hou-Chao Zhang, Rui Wang, Hong-Bo Lan, Xiao-Yang Zhu
{"title":"Structural design and simulation of PDMS/SiC functionally graded substrates for applications in flexible hybrid electronics","authors":"Jian-Jun Yang, Yin-Bao Song, Zheng-Hao Li, Luo-Wei Wang, Shuai Shang, Hong-Ke Li, Hou-Chao Zhang, Rui Wang, Hong-Bo Lan, Xiao-Yang Zhu","doi":"10.1007/s40436-024-00510-3","DOIUrl":null,"url":null,"abstract":"<p>Flexible hybrid electronics possess significant potential for applications in biomedical and wearable devices due to their advantageous properties of good ductility, low mass, and portability. However, they often exhibit a substantial disparity in elastic modulus between the flexible substrate and rigid components. This discrepancy can result in damage to the rigid components themselves and detachment from the substrate when subjected to tensile, bending, or other loads. Consequently, it diminishes the lifespan of flexible hybrid electronics and restricts their broader-scale application. Therefore, this paper proposes a polydimethylsiloxane (PDMS)/SiC functionally graded flexible substrate based on variable stiffness properties. Initially, ABAQUS simulation is employed to analyze how variations in stiffness impact the stress-strain behavior of PDMS/SiC functionally graded flexible substrates. Subsequently, we propose a multi-material 3D printing process for fabricating PDMS/SiC functionally graded flexible substrates and develop an advanced multi-material 3D printing equipment to facilitate this process. Tensile specimens with the functional gradient of PDMS/SiC are successfully fabricated and subjected to mechanical testing. The results from the tensile tests demonstrate a significant enhancement in the tensile rate (from 21.6% to 35%) when utilizing the PDMS/SiC functionally graded flexible substrate compared to those employing only PDMS substrate. Furthermore, the application of PDMS/SiC functional gradient flexible substrate exhibits remarkable bending and tensile properties in stretchable electronics and skin electronics domains. The integrated fabrication approach of the PDMS/SiC functionally graded flexible substrate structure presents a novel high-performance solution along with its corresponding 3D printing methodology for stretchable flexible electronics, skin electronics, and other related fields.</p>","PeriodicalId":7342,"journal":{"name":"Advances in Manufacturing","volume":"10 1","pages":""},"PeriodicalIF":4.2000,"publicationDate":"2024-07-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s40436-024-00510-3","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
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Abstract

Flexible hybrid electronics possess significant potential for applications in biomedical and wearable devices due to their advantageous properties of good ductility, low mass, and portability. However, they often exhibit a substantial disparity in elastic modulus between the flexible substrate and rigid components. This discrepancy can result in damage to the rigid components themselves and detachment from the substrate when subjected to tensile, bending, or other loads. Consequently, it diminishes the lifespan of flexible hybrid electronics and restricts their broader-scale application. Therefore, this paper proposes a polydimethylsiloxane (PDMS)/SiC functionally graded flexible substrate based on variable stiffness properties. Initially, ABAQUS simulation is employed to analyze how variations in stiffness impact the stress-strain behavior of PDMS/SiC functionally graded flexible substrates. Subsequently, we propose a multi-material 3D printing process for fabricating PDMS/SiC functionally graded flexible substrates and develop an advanced multi-material 3D printing equipment to facilitate this process. Tensile specimens with the functional gradient of PDMS/SiC are successfully fabricated and subjected to mechanical testing. The results from the tensile tests demonstrate a significant enhancement in the tensile rate (from 21.6% to 35%) when utilizing the PDMS/SiC functionally graded flexible substrate compared to those employing only PDMS substrate. Furthermore, the application of PDMS/SiC functional gradient flexible substrate exhibits remarkable bending and tensile properties in stretchable electronics and skin electronics domains. The integrated fabrication approach of the PDMS/SiC functionally graded flexible substrate structure presents a novel high-performance solution along with its corresponding 3D printing methodology for stretchable flexible electronics, skin electronics, and other related fields.

Abstract Image

应用于柔性混合电子器件的 PDMS/SiC 功能分级基底的结构设计与模拟
柔性混合电子器件具有良好的延展性、低质量和便携性等优势,因此在生物医学和可穿戴设备领域具有巨大的应用潜力。然而,柔性基底和刚性元件之间的弹性模量往往存在巨大差异。当受到拉伸、弯曲或其他载荷时,这种差异可能会导致刚性部件本身损坏或从基底上脱落。因此,它会缩短柔性混合电子元件的使用寿命,限制其更广泛的应用。因此,本文提出了一种基于可变刚度特性的聚二甲基硅氧烷(PDMS)/碳化硅功能分级柔性基板。首先,我们采用 ABAQUS 仿真分析了刚度变化如何影响 PDMS/SiC 功能分级柔性基底的应力-应变行为。随后,我们提出了一种用于制造 PDMS/SiC 功能分级柔性基底的多材料三维打印工艺,并开发了一种先进的多材料三维打印设备来促进这一工艺。我们成功制作了具有 PDMS/SiC 功能梯度的拉伸试样,并对其进行了力学测试。拉伸试验结果表明,与仅使用 PDMS 基材的拉伸试验相比,使用 PDMS/SiC 功能梯度柔性基材的拉伸率显著提高(从 21.6% 提高到 35%)。此外,PDMS/SiC 功能梯度柔性衬底在可拉伸电子器件和皮肤电子器件领域的应用还表现出卓越的弯曲和拉伸性能。PDMS/SiC 功能梯度柔性衬底结构的集成制造方法及其相应的 3D 打印方法为可拉伸柔性电子器件、皮肤电子器件和其他相关领域提供了一种新型高性能解决方案。
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来源期刊
Advances in Manufacturing
Advances in Manufacturing Materials Science-Polymers and Plastics
CiteScore
9.10
自引率
3.80%
发文量
274
期刊介绍: As an innovative, fundamental and scientific journal, Advances in Manufacturing aims to describe the latest regional and global research results and forefront developments in advanced manufacturing field. As such, it serves as an international platform for academic exchange between experts, scholars and researchers in this field. All articles in Advances in Manufacturing are peer reviewed. Respected scholars from the fields of advanced manufacturing fields will be invited to write some comments. We also encourage and give priority to research papers that have made major breakthroughs or innovations in the fundamental theory. The targeted fields include: manufacturing automation, mechatronics and robotics, precision manufacturing and control, micro-nano-manufacturing, green manufacturing, design in manufacturing, metallic and nonmetallic materials in manufacturing, metallurgical process, etc. The forms of articles include (but not limited to): academic articles, research reports, and general reviews.
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