Manufacturing and measurement of CMOS-MEMS-based micro thermoelectric generators with long-length thermocouples

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhi-Xuan Dai, Chun-Yu Chen, Bo-Chun Chiu, Chi-Yuan Lee
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Abstract

The study explores the fabrication and evaluation of a micro thermoelectric generator (MTG) with long-length thermocouples (TCs) through the utilization of a commercial complementary metal oxide semiconductor process. The MTG consists of 23 TCs, and its performance is intricately linked to the temperature difference (T diff) between the cold and hot sides of these TCs. An increase in T diff leads to higher output voltage and power for the MTG. To enhance T diff, the TCs are designed to be 700 µm in length, and an innovative design has been implemented on the cold side of the TCs, creating a suspended structure to improve heat dissipation A post-process is essential for achieving this suspended TC structure. The results demonstrate that the TC structure is fully suspended and remains undamaged. The measured outcomes reveal an output voltage of 13.8 mV when the T diff reaches 3.5 K. Under these conditions, the MTG exhibits a voltage factor of 2.76 mV mm−2K−1. Furthermore, at a T diff of 3.5 K, the maximum output power reaches 2.1 nW. The MTG demonstrates a power factor of 0.12 nW mm−2 K−2.
基于 CMOS-MEMS 的带长热电偶的微型热电发生器的制造和测量
本研究探讨了如何利用商用互补金属氧化物半导体工艺制造和评估带有长热电偶(TC)的微型热电发生器(MTG)。微型热电发生器由 23 个热电偶组成,其性能与这些热电偶冷端和热端之间的温差 (Tdiff) 密切相关。Tdiff 增加可提高 MTG 的输出电压和功率。为了提高 Tdiff,TC 的长度设计为 700 微米,并在 TC 的冷侧采用了创新设计,创建了一个悬浮结构以改善散热。结果表明,TC 结构是完全悬浮的,并且没有损坏。测量结果显示,当温度差达到 3.5 K 时,输出电压为 13.8 mV。此外,在温度差为 3.5 K 时,最大输出功率达到 2.1 nW。MTG 的功率因数为 0.12 nW mm-2 K-2。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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