Zhi-Xuan Dai, Chun-Yu Chen, Bo-Chun Chiu, Chi-Yuan Lee
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引用次数: 0
Abstract
The study explores the fabrication and evaluation of a micro thermoelectric generator (MTG) with long-length thermocouples (TCs) through the utilization of a commercial complementary metal oxide semiconductor process. The MTG consists of 23 TCs, and its performance is intricately linked to the temperature difference (Tdiff) between the cold and hot sides of these TCs. An increase in Tdiff leads to higher output voltage and power for the MTG. To enhance Tdiff, the TCs are designed to be 700 µm in length, and an innovative design has been implemented on the cold side of the TCs, creating a suspended structure to improve heat dissipation A post-process is essential for achieving this suspended TC structure. The results demonstrate that the TC structure is fully suspended and remains undamaged. The measured outcomes reveal an output voltage of 13.8 mV when the Tdiff reaches 3.5 K. Under these conditions, the MTG exhibits a voltage factor of 2.76 mV mm−2K−1. Furthermore, at a Tdiff of 3.5 K, the maximum output power reaches 2.1 nW. The MTG demonstrates a power factor of 0.12 nW mm−2 K−2.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.