Insights into molecular and bulk mechanical properties of glassy carbon through molecular dynamics simulations and mechanical tensile testing

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Manali Kunte, Lucía Carballo Chanfón, Surabhi Nimbalkar, James Bunnell, Emanuel Rodriguez Barajas, Mario Enrique Vazquez, David Trejo-Rodriguez, Carter Faucher, Skelly Smith and Sam Kassegne
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Abstract

With increasing interest in the use of glassy carbon (GC) for a broad range of application areas, the need for developing a fundamental understanding of its mechanical properties has come to the forefront. Furthermore, recent theoretical and modeling works that highlight the synthesis of GC via the pyrolysis of polymer precursors has explored the possibilities of a revisit to the investigation of their mechanical properties at a fundamental level. Although there are isolated reports on the experimental determination of its elastic modulus, insights into the stress-strain behavior of a GC material under tension and compression obtained through simulations, either at the molecular level or for the bulk materials, are missing. This study fills the gap at the molecular level and investigates the mechanical properties of GC using molecular dynamics (MD) simulations, which model the atomistic-level formation and breaking of bonds using bond-order-based reactive force field formulations. The molecular model considered in this simulation has a characteristic 3D cage-like structure of five-, six-, and seven-membered carbon rings and graphitic domains of a flat graphene-like structure. The GC molecular model was subjected to loading under varying strain rates (0.4, 0.6, 1.25, and 2.5 ns−1) and temperatures (300 K–800 K) in each of the three axes: x, y, and z. The simulations show that the GC nanostructure has distinct stress-strain curves under tension and compression. In tension, MD modeling predicted a mean elastic modulus of 5.71GPa for a single GC nanostructure with some dependency on the strain rate and temperature, whereas, in compression, the elastic modulus was also found to depend on the strain rate and temperature and was predicted to have a mean value of 35 GPa. To validate the simulation results and develop experimental insights into the bulk behavior, mechanical tests were conducted on dog-bone-shaped testing coupons that were subjected to uniaxial tension and loaded until failure. The GC test coupons demonstrated a bulk modulus of 17 ±2.69 GPa in tension, which compares well with those reported in the literature. However, comparing MD simulation outcomes to those of uniaxial mechanical testing reveals that the bulk modulus of GC in tension found experimentally is higher than the modulus of single GC nanostructures predicted by MD modeling, which inherently underestimates the bulk modulus. With regard to failure modes, the MD simulations predicted failure in tension accompanied by the breaking of carbon rings within the molecular structure. In contrast, the mechanical testing demonstrated that failure modes are dominated by brittle failure planes largely due to the amorphous structure of GC.
通过分子动力学模拟和机械拉伸测试深入了解玻璃碳的分子和块体机械特性
随着人们对将玻璃碳(GC)应用于广泛领域的兴趣与日俱增,从根本上了解玻璃碳机械特性的必要性已凸显出来。此外,最近的理论和建模工作强调了通过热解聚合物前驱体合成玻璃碳,这为从根本上重新研究其机械特性提供了可能性。虽然有个别关于弹性模量实验测定的报告,但通过分子水平或大块材料的模拟,对 GC 材料在拉伸和压缩条件下的应力-应变行为还缺乏深入了解。本研究填补了分子水平上的空白,并利用分子动力学(MD)模拟研究了 GC 的机械特性,该模拟利用基于键序的反应力场公式对原子水平的键形成和断裂进行建模。该模拟中考虑的分子模型具有由五元、六元和七元碳环组成的三维笼状结构以及扁平石墨烯状结构的石墨域。在不同的应变速率(0.4、0.6、1.25 和 2.5 ns-1)和温度(300 K-800 K)条件下,GC 分子模型在 x、y 和 z 三个轴上分别受到加载。在拉伸过程中,MD 模型预测单个 GC 纳米结构的平均弹性模量为 5.71GPa,与应变速率和温度有一定关系;而在压缩过程中,弹性模量也与应变速率和温度有关,预测平均值为 35GPa。为了验证模拟结果,并通过实验深入了解块体行为,对狗骨形测试券进行了机械测试,测试券受到单轴拉伸和加载,直至失效。GC 试样在拉伸时的体模为 17 ±2.69 GPa,与文献报道的结果相差无几。然而,将 MD 模拟结果与单轴机械测试结果进行比较后发现,实验发现的 GC 拉伸时的体积模量高于 MD 建模预测的单个 GC 纳米结构的模量,而 MD 建模本质上低估了体积模量。关于失效模式,MD 模拟预测拉伸失效伴随着分子结构内碳环的断裂。相反,机械测试表明,主要由于 GC 的无定形结构,失效模式以脆性失效平面为主。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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