{"title":"Surface Interaction and Wear due to Sliding Electrical Contact of Materials","authors":"Xiaoman Wang, Q.Jane Wang, W.Wayne Chen, Yip-Wah Chung, Hirotaka Miwa, Toshikazu Nanbu, Yoshitaka Uehara, YuanYuan, Shuangbiao Liu, Dong Zhu","doi":"10.1080/10402004.2024.2369208","DOIUrl":null,"url":null,"abstract":"This paper reports a research study on sliding-electrical contacts of copper-diamond materials, involving modeling and validation, contact status simulations, and parametric studies. The simulation...","PeriodicalId":23315,"journal":{"name":"Tribology Transactions","volume":"31 1","pages":""},"PeriodicalIF":2.0000,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tribology Transactions","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/10402004.2024.2369208","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports a research study on sliding-electrical contacts of copper-diamond materials, involving modeling and validation, contact status simulations, and parametric studies. The simulation...
期刊介绍:
Tribology Transactions contains experimental and theoretical papers on friction, wear, lubricants, lubrication, materials, machines and moving components, from the macro- to the nano-scale.
The papers will be of interest to academic, industrial and government researchers and technologists working in many fields, including:
Aerospace, Agriculture & Forest, Appliances, Automotive, Bearings, Biomedical Devices, Condition Monitoring, Engines, Gears, Industrial Engineering, Lubricants, Lubricant Additives, Magnetic Data Storage, Manufacturing, Marine, Materials, MEMs and NEMs, Mining, Power Generation, Metalworking Fluids, Seals, Surface Engineering and Testing and Analysis.
All submitted manuscripts are subject to initial appraisal by the Editor-in-Chief and, if found suitable for further consideration, are submitted for peer review by independent, anonymous expert referees. All peer review in single blind and submission is online via ScholarOne Manuscripts.