{"title":"Machinability of elliptical ultrasonic vibration milling γ-TiAl: Chip formation, edge breakage, and subsurface layer deformation","authors":"Ziwen XIA, Chenwei Shan, Meng-xu Zhang, Wengang Liu, Minchao Cui, Ming Luo","doi":"10.1016/j.cja.2024.06.005","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":503943,"journal":{"name":"Chinese Journal of Aeronautics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chinese Journal of Aeronautics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.cja.2024.06.005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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