{"title":"Research on the mechanism of dynamic avalanche induced by IGBT short circuit and its influencing factors","authors":"Yuting Liu","doi":"10.61173/efjknq86","DOIUrl":null,"url":null,"abstract":"The insulated gate bipolar transistor (IGBT) is currently the most important power electronic device. It has a simple drive circuit, high operating frequency, and stable temperature. Through structural optimization and the development of new materials, its voltage and power levels have gradually increased. First, a four-unit parallel device model was established, and the electric-thermal coupling numerical simulation method was used to simulate the current, electric field, hole concentration, temperature distribution, impact ionization rate and other parameters during the dynamic avalanche process of Type II IGBT, revealing the conditions under short-circuit conditions. dynamic avalanche mechanism. On this basis, different structural parameters were compared and analyzed.","PeriodicalId":438278,"journal":{"name":"Science and Technology of Engineering, Chemistry and Environmental Protection","volume":"26 41","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Science and Technology of Engineering, Chemistry and Environmental Protection","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.61173/efjknq86","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The insulated gate bipolar transistor (IGBT) is currently the most important power electronic device. It has a simple drive circuit, high operating frequency, and stable temperature. Through structural optimization and the development of new materials, its voltage and power levels have gradually increased. First, a four-unit parallel device model was established, and the electric-thermal coupling numerical simulation method was used to simulate the current, electric field, hole concentration, temperature distribution, impact ionization rate and other parameters during the dynamic avalanche process of Type II IGBT, revealing the conditions under short-circuit conditions. dynamic avalanche mechanism. On this basis, different structural parameters were compared and analyzed.
绝缘栅双极晶体管(IGBT)是目前最重要的电力电子器件。它具有驱动电路简单、工作频率高、温度稳定等特点。通过结构优化和新材料的开发,其电压和功率水平逐渐提高。首先,建立了四单元并联器件模型,并采用电热耦合数值模拟方法模拟了 II 型 IGBT 动态雪崩过程中的电流、电场、空穴浓度、温度分布、冲击电离率等参数,揭示了短路条件下的情况。在此基础上,对不同的结构参数进行了比较和分析。