Experimental analysis of chemical removal effect in RISA grinding of optical glass

Abstract

In the large-aperture lens manufacturing, not only high surface quality but also high productivity is required. From this perspective, Reaction-Induced-Slurry-Assisted grinding (RISA grinding), in which cerium oxide slurry is supplied instead of using general grinding fluid, has been developed to achieve high surface quality at high removal rate. However, the surface profile error becomes large due to chemical removal effect of the cerium oxide slurry. Therefore, the purpose of this study is to experimentally investigate the influence of the chemical removal effect on the surface profile error using AE signals and servo current signals in RISA grinding. First, relation between dwell time and removal depth is analyzed by conducting a basic grinding test without the workpiece rotation. The result shows that the actual removal depth increases with increase of dwell time despite applying the constant depth of cut. Then, zero-cut RISA grinding test is conducted. It is found that the removal process proceeds even though zero-cut grinding, and its removal rate varies according to the wheel feed rate. Furthermore, the amount of cerium oxide abrasives adhered to the grinding wheel can be estimated from the AE signals and servo current signals.