An Introduction to the Compute Express Link (CXL) Interconnect

IF 23.8 1区 计算机科学 Q1 COMPUTER SCIENCE, THEORY & METHODS
Debendra Das Sharma, Robert Blankenship, Daniel Berger
{"title":"An Introduction to the Compute Express Link (CXL) Interconnect","authors":"Debendra Das Sharma, Robert Blankenship, Daniel Berger","doi":"10.1145/3669900","DOIUrl":null,"url":null,"abstract":"<p>The Compute Express Link (CXL) is an open industry-standard interconnect between processors and devices such as accelerators, memory buffers, smart network interfaces, persistent memory, and solid-state drives. CXL offers coherency and memory semantics with bandwidth that scales with PCIe bandwidth while achieving significantly lower latency than PCIe. All major CPU vendors, device vendors, and datacenter operators have adopted CXL as a common standard. This enables an inter-operable ecosystem that supports key computing use cases including highly efficient accelerators, server memory bandwidth and capacity expansion, multi-server resource pooling and sharing, and efficient peer-to-peer communication. This survey provides an introduction to CXL covering the standards CXL 1.0, CXL 2.0, and CXL 3.0. We further survey CXL implementations, discuss CXL's impact on the datacenter landscape, and future directions.</p>","PeriodicalId":50926,"journal":{"name":"ACM Computing Surveys","volume":null,"pages":null},"PeriodicalIF":23.8000,"publicationDate":"2024-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM Computing Surveys","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1145/3669900","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"COMPUTER SCIENCE, THEORY & METHODS","Score":null,"Total":0}
引用次数: 0

Abstract

The Compute Express Link (CXL) is an open industry-standard interconnect between processors and devices such as accelerators, memory buffers, smart network interfaces, persistent memory, and solid-state drives. CXL offers coherency and memory semantics with bandwidth that scales with PCIe bandwidth while achieving significantly lower latency than PCIe. All major CPU vendors, device vendors, and datacenter operators have adopted CXL as a common standard. This enables an inter-operable ecosystem that supports key computing use cases including highly efficient accelerators, server memory bandwidth and capacity expansion, multi-server resource pooling and sharing, and efficient peer-to-peer communication. This survey provides an introduction to CXL covering the standards CXL 1.0, CXL 2.0, and CXL 3.0. We further survey CXL implementations, discuss CXL's impact on the datacenter landscape, and future directions.

计算高速链路 (CXL) 互连简介
Compute Express Link(CXL)是处理器与加速器、内存缓冲器、智能网络接口、持久内存和固态硬盘等设备之间的开放式行业标准互连。CXL 提供一致性和内存语义,其带宽可与 PCIe 带宽相匹配,同时延迟大大低于 PCIe。所有主要 CPU 供应商、设备供应商和数据中心运营商都已采用 CXL 作为通用标准。这样就形成了一个可互操作的生态系统,支持包括高效加速器、服务器内存带宽和容量扩展、多服务器资源池和共享以及高效点对点通信在内的关键计算用例。本调查介绍了 CXL,包括 CXL 1.0、CXL 2.0 和 CXL 3.0 标准。我们将进一步调查 CXL 的实施情况,讨论 CXL 对数据中心格局的影响以及未来的发展方向。
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来源期刊
ACM Computing Surveys
ACM Computing Surveys 工程技术-计算机:理论方法
CiteScore
33.20
自引率
0.60%
发文量
372
审稿时长
12 months
期刊介绍: ACM Computing Surveys is an academic journal that focuses on publishing surveys and tutorials on various areas of computing research and practice. The journal aims to provide comprehensive and easily understandable articles that guide readers through the literature and help them understand topics outside their specialties. In terms of impact, CSUR has a high reputation with a 2022 Impact Factor of 16.6. It is ranked 3rd out of 111 journals in the field of Computer Science Theory & Methods. ACM Computing Surveys is indexed and abstracted in various services, including AI2 Semantic Scholar, Baidu, Clarivate/ISI: JCR, CNKI, DeepDyve, DTU, EBSCO: EDS/HOST, and IET Inspec, among others.
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