Stochastic simulation of exciton transport in semiconductor heterostructures

Pub Date : 2024-06-01 DOI:10.1515/rnam-2024-0014
Karl Sabelfeld, I. Aksyuk
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Abstract

Stochastic simulation algorithm for solving exciton transport in a 3D layered semiconductor heterostructure is developed. The problem is governed by a transient drift-diffusion-recombination equation with Dirichlet and Neumann mixed boundary conditions. The semiconductor is represented as an infinite multilayer of finite thickness along the transverse coordinate z. The multilayer is composed by a set of sublayers of different materials so that the excitons have different diffusion and recombination coefficients in each layer. Continuity of solutions and fluxes at the plane interfaces between layers are imposed. The stochastic simulation algorithm solves the transport problem by tracking exciton trajectories in accordance with the probability distributions represented through the Green function of the problem in each sublayer. The method is meshless, the excitons jump only over the plane boundaries of the layers. This explains the high efficiency of the method. Simulation results for transport problems with different mixed boundary conditions are presented.
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半导体异质结构中激子传输的随机模拟
开发了解决三维层状半导体异质结构中激子传输问题的随机模拟算法。该问题受瞬态漂移-扩散-再结合方程支配,具有 Dirichlet 和 Neumann 混合边界条件。该多层结构由一组不同材料的子层组成,因此激子在各层中的扩散和重组系数各不相同。在层与层之间的平面界面上,求解和通量是连续的。随机模拟算法根据每个子层中问题的格林函数所代表的概率分布,通过跟踪激子轨迹来解决传输问题。该方法是无网格的,激子只在层的平面边界上跃迁。这就是该方法高效的原因。本文介绍了不同混合边界条件下传输问题的模拟结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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