{"title":"Reliability and Chiplets","authors":"Jason Rupe","doi":"10.1109/MRL.2024.3386643","DOIUrl":null,"url":null,"abstract":"Chiplet technology is a favored way to push Moore’s law to overcome the chip shrinkage problem, where the smaller scale needed leads to smaller yields. Through chiplets, smaller functional building blocks can be interconnected as needed in flexible ways and scale with new advantages. There are reliability challenges, but they can be overcome with good reliability engineering and practice. The resulting chiplet technology brings new advantages too. With these new advantages comes the potential for greater reliability for the customer. In this column, I explore chiplets, and I invite you to “chip in”!","PeriodicalId":517825,"journal":{"name":"IEEE Reliability Magazine","volume":"76 2","pages":"8-11"},"PeriodicalIF":0.0000,"publicationDate":"2024-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Reliability Magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MRL.2024.3386643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Chiplet technology is a favored way to push Moore’s law to overcome the chip shrinkage problem, where the smaller scale needed leads to smaller yields. Through chiplets, smaller functional building blocks can be interconnected as needed in flexible ways and scale with new advantages. There are reliability challenges, but they can be overcome with good reliability engineering and practice. The resulting chiplet technology brings new advantages too. With these new advantages comes the potential for greater reliability for the customer. In this column, I explore chiplets, and I invite you to “chip in”!