Reliability and Chiplets

Jason Rupe
{"title":"Reliability and Chiplets","authors":"Jason Rupe","doi":"10.1109/MRL.2024.3386643","DOIUrl":null,"url":null,"abstract":"Chiplet technology is a favored way to push Moore’s law to overcome the chip shrinkage problem, where the smaller scale needed leads to smaller yields. Through chiplets, smaller functional building blocks can be interconnected as needed in flexible ways and scale with new advantages. There are reliability challenges, but they can be overcome with good reliability engineering and practice. The resulting chiplet technology brings new advantages too. With these new advantages comes the potential for greater reliability for the customer. In this column, I explore chiplets, and I invite you to “chip in”!","PeriodicalId":517825,"journal":{"name":"IEEE Reliability Magazine","volume":"76 2","pages":"8-11"},"PeriodicalIF":0.0000,"publicationDate":"2024-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Reliability Magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MRL.2024.3386643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Chiplet technology is a favored way to push Moore’s law to overcome the chip shrinkage problem, where the smaller scale needed leads to smaller yields. Through chiplets, smaller functional building blocks can be interconnected as needed in flexible ways and scale with new advantages. There are reliability challenges, but they can be overcome with good reliability engineering and practice. The resulting chiplet technology brings new advantages too. With these new advantages comes the potential for greater reliability for the customer. In this column, I explore chiplets, and I invite you to “chip in”!
可靠性和芯片组
芯片技术是推动摩尔定律以克服芯片萎缩问题的一种有效方法。通过芯片,较小的功能构件可以根据需要以灵活的方式相互连接,并以新的优势扩大规模。虽然存在可靠性方面的挑战,但可以通过良好的可靠性工程和实践加以克服。由此产生的芯片技术也带来了新的优势。有了这些新优势,客户就有可能获得更高的可靠性。在本专栏中,我将探讨芯片技术,并邀请您 "加入进来"!
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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