Thermo-mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry
Thermomechanisches Verhalten von Kugelgitterpackungen mit unterschiedlichen Lotkugelgittermustern, untersucht durch Moiré-Interferometrie
IF 1.2 4区 材料科学Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
{"title":"Thermo-mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry\n Thermomechanisches Verhalten von Kugelgitterpackungen mit unterschiedlichen Lotkugelgittermustern, untersucht durch Moiré-Interferometrie","authors":"J. W. Joo","doi":"10.1002/mawe.202400029","DOIUrl":null,"url":null,"abstract":"<p>Plastic ball-grid array (PBGA) package assembly comprises various materials with different thermo-mechanical properties, and the solder ball-grid patterns can significantly influence the package deformation and solder ball stress. This study utilizes moiré interferometry to investigate the deformation behavior of wire bonded plastic ball-grid array (WB-PBGA) packages under varying temperatures. Real-time moiré interferometry experiments were conducted to capture fringe patterns representing package deformation at different temperature stages. Experiments were conducted for three different wire bonded plastic ball-grid array packages with distinct solder ball array configurations: full grid patterns (WB-PBGA-FG) and perimeter patterns with/without central connections (WB-PBGA-PC/P). The analysis revealed considerable variations in thermal strain distribution and positioning of the critical solder ball within the package assembly, depending on the solder ball-grid pattern. Among these wire bonded plastic ball-grid array packages, WB-PBGA-P/C exhibited the most substantial bending deformation, experiencing the highest effective strain, which directly impacts solder ball failure. These findings emphasize the importance of solder ball-grid patterns in understanding the deformation behavior and reliability of WB-PBGA packages under varying temperature conditions.</p>","PeriodicalId":18366,"journal":{"name":"Materialwissenschaft und Werkstofftechnik","volume":null,"pages":null},"PeriodicalIF":1.2000,"publicationDate":"2024-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materialwissenschaft und Werkstofftechnik","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/mawe.202400029","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Plastic ball-grid array (PBGA) package assembly comprises various materials with different thermo-mechanical properties, and the solder ball-grid patterns can significantly influence the package deformation and solder ball stress. This study utilizes moiré interferometry to investigate the deformation behavior of wire bonded plastic ball-grid array (WB-PBGA) packages under varying temperatures. Real-time moiré interferometry experiments were conducted to capture fringe patterns representing package deformation at different temperature stages. Experiments were conducted for three different wire bonded plastic ball-grid array packages with distinct solder ball array configurations: full grid patterns (WB-PBGA-FG) and perimeter patterns with/without central connections (WB-PBGA-PC/P). The analysis revealed considerable variations in thermal strain distribution and positioning of the critical solder ball within the package assembly, depending on the solder ball-grid pattern. Among these wire bonded plastic ball-grid array packages, WB-PBGA-P/C exhibited the most substantial bending deformation, experiencing the highest effective strain, which directly impacts solder ball failure. These findings emphasize the importance of solder ball-grid patterns in understanding the deformation behavior and reliability of WB-PBGA packages under varying temperature conditions.
期刊介绍:
Materialwissenschaft und Werkstofftechnik provides fundamental and practical information for those concerned with materials development, manufacture, and testing.
Both technical and economic aspects are taken into consideration in order to facilitate choice of the material that best suits the purpose at hand. Review articles summarize new developments and offer fresh insight into the various aspects of the discipline.
Recent results regarding material selection, use and testing are described in original articles, which also deal with failure treatment and investigation. Abstracts of new publications from other journals as well as lectures presented at meetings and reports about forthcoming events round off the journal.