Formulation analysis and follow-up study of multi-turn configuration for performance enhancement of MEMS piezoresistive pressure sensor utilized for low-pressure measurement applications

IF 1.6 4区工程技术 Q3 INSTRUMENTS & INSTRUMENTATION

Sensor Review Pub Date : 2024-05-21 DOI:10.1108/sr-02-2024-0115

Dadasikandar Kanekal, Eshan Sabhapandit, S. Jindal, H. Patil

{"title":"Formulation analysis and follow-up study of multi-turn configuration for performance enhancement of MEMS piezoresistive pressure sensor utilized for low-pressure measurement applications","authors":"Dadasikandar Kanekal, Eshan Sabhapandit, S. Jindal, H. Patil","doi":"10.1108/sr-02-2024-0115","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this research is to study the performance of piezoresistive pressure sensors using polysilicon as the piezoresistive material, which is typically used to measure pressure in high-temperature environments.\n\n\nDesign/methodology/approach\nThe performance of this sensor is enhanced by studying the influence of multi-turn configuration at which the piezoresistors are arranged. Different configurations are studied and compared by laying down their analytical solution.\n\n\nFindings\nThe validation of analytical results is accomplished through finite element analysis using the software COMSOL Multiphysics. The best configuration, which uses a partial triple-turn configuration, was able to achieve a sensitivity of 116.00 mV/V/MPa over a simulated pressure range of 0 to 500 KPa.\n\n\nOriginality/value\nThe literature shows the study of single-turn and double-turn meander-shaped configuration of micro-electromechanical systems piezoresistive pressure sensor but multi-turn meander-shaped configuration using a square silicon diaphragm has not been reported. Its study has reflected promising results than its counterparts based on key performance parameters such as sensitivity and linearity and are more effective to be used for automotive, aviation, biomedical and consumer electronics applications.\n","PeriodicalId":49540,"journal":{"name":"Sensor Review","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensor Review","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/sr-02-2024-0115","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"INSTRUMENTS & INSTRUMENTATION","Score":null,"Total":0}

引用次数: 0

Abstract

Purpose The purpose of this research is to study the performance of piezoresistive pressure sensors using polysilicon as the piezoresistive material, which is typically used to measure pressure in high-temperature environments. Design/methodology/approach The performance of this sensor is enhanced by studying the influence of multi-turn configuration at which the piezoresistors are arranged. Different configurations are studied and compared by laying down their analytical solution. Findings The validation of analytical results is accomplished through finite element analysis using the software COMSOL Multiphysics. The best configuration, which uses a partial triple-turn configuration, was able to achieve a sensitivity of 116.00 mV/V/MPa over a simulated pressure range of 0 to 500 KPa. Originality/value The literature shows the study of single-turn and double-turn meander-shaped configuration of micro-electromechanical systems piezoresistive pressure sensor but multi-turn meander-shaped configuration using a square silicon diaphragm has not been reported. Its study has reflected promising results than its counterparts based on key performance parameters such as sensitivity and linearity and are more effective to be used for automotive, aviation, biomedical and consumer electronics applications.

查看原文本刊更多论文

用于低压测量应用的 MEMS 压阻式压力传感器性能提升多圈配置的配方分析和后续研究

目的本研究的目的是研究使用多晶硅作为压阻材料的压阻压力传感器的性能，这种传感器通常用于测量高温环境中的压力。通过使用 COMSOL Multiphysics 软件进行有限元分析，对分析结果进行了验证。使用部分三圈配置的最佳配置能够在 0 至 500 KPa 的模拟压力范围内实现 116.00 mV/V/MPa 的灵敏度。原创性/价值文献显示了对微机电系统压阻压力传感器的单圈和双圈蜿蜒形配置的研究，但使用方形硅膜片的多圈蜿蜒形配置尚未见报道。根据灵敏度和线性度等关键性能参数，其研究结果比同类产品更有前途，更能有效地用于汽车、航空、生物医学和消费电子应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Sensor Review 工程技术-仪器仪表

CiteScore

3.40

自引率

6.20%

发文量

审稿时长

3.7 months

期刊介绍： Sensor Review publishes peer reviewed state-of-the-art articles and specially commissioned technology reviews. Each issue of this multidisciplinary journal includes high quality original content covering all aspects of sensors and their applications, and reflecting the most interesting and strategically important research and development activities from around the world. Because of this, readers can stay at the very forefront of high technology sensor developments. Emphasis is placed on detailed independent regular and review articles identifying the full range of sensors currently available for specific applications, as well as highlighting those areas of technology showing great potential for the future. The journal encourages authors to consider the practical and social implications of their articles. All articles undergo a rigorous double-blind peer review process which involves an initial assessment of suitability of an article for the journal followed by sending it to, at least two reviewers in the field if deemed suitable. Sensor Review’s coverage includes, but is not restricted to: Mechanical sensors – position, displacement, proximity, velocity, acceleration, vibration, force, torque, pressure, and flow sensors Electric and magnetic sensors – resistance, inductive, capacitive, piezoelectric, eddy-current, electromagnetic, photoelectric, and thermoelectric sensors Temperature sensors, infrared sensors, humidity sensors Optical, electro-optical and fibre-optic sensors and systems, photonic sensors Biosensors, wearable and implantable sensors and systems, immunosensors Gas and chemical sensors and systems, polymer sensors Acoustic and ultrasonic sensors Haptic sensors and devices Smart and intelligent sensors and systems Nanosensors, NEMS, MEMS, and BioMEMS Quantum sensors Sensor systems: sensor data fusion, signals, processing and interfacing, signal conditioning.