Renato A. Ferreira, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, Lucas F. M. da Silva
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引用次数: 0
Abstract
Chip packaging engineering has evolved significantly to meet the performance demands of integrated circuits (IC) and micro-electromechanical systems (MEMS). Layers, mainly composed of metals, ceram...
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