Comparative analysis of thermal interface materials for effective thermal management of electronic devices

IF 2.5 3区工程技术 Q2 ENGINEERING, MECHANICAL

Experimental Heat Transfer Pub Date : 2024-05-07 DOI:10.1080/08916152.2024.2352105

Saddam Husain, Mohammad Asif, Khursheed Anwar Khan

引用次数: 0

Abstract

Thermal interface materials (TIM) employed to electronic devices enhances interfacial heat dissipation and thermal contact conductance (TCC). This study compares the performance of TIMs (silicon gr...

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电子设备有效热管理的热界面材料比较分析

电子设备采用的热界面材料（TIM）可增强界面散热和热接触电导率（TCC）。本研究比较了热界面材料（硅栅）和热接触材料（热接触导体）的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Experimental Heat Transfer 工程技术-工程：机械

CiteScore

6.30

自引率

37.10%

发文量

审稿时长

>12 weeks

期刊介绍： Experimental Heat Transfer provides a forum for experimentally based high quality research articles and communications in the general area of heat-mass transfer and the related energy fields. In addition to the established multifaceted areas of heat transfer and the associated thermal energy conversion, transport, and storage, the journal also communicates contributions from new and emerging areas of research such as micro- and nanoscale science and technology, life sciences and biomedical engineering, manufacturing processes, materials science, and engineering. Heat transfer plays an important role in all of these areas, particularly in the form of innovative experiments and systems for direct measurements and analysis, as well as to verify or complement theoretical models. All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. All peer reviews are single blind and submission is online via ScholarOne Manuscripts. Original, normal size articles, as well as technical notes are considered. Review articles require previous communication and approval by the Editor before submission for further consideration.