Investigation of the Strength Properties of Single-Crystal InSb Depending on Crystallographic Orientation and Growth Conditions

IF 0.4 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
N. Yu. Komarovskii, E. V. Molodtsova, A. A. Trofimov, S. S. Kormilitsina, V. A. Ul’karov, M. S. Nestyurkin, A. A. Zarechenskaya, D. O. Tsaregorodtsev
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Abstract

The work is devoted to research of limits of applicability of X-ray analysis, light microscopy, and study of microhardness of samples surface within the framework of estimation of complex mechanical characteristics of single crystals, which largely determine output of good products (wafers) and form its final cost. Methods of investigation of mechanical properties regulated by GOST often refer to metals and alloys and are not applicable to semiconductor materials. In this regard, a particularly urgent task is to develop a method to evaluate the resistance of semiconductor wafers to brittle fracture, allowing the prospect of optimizing the technological regime of growth of single crystals, potentially reducing the final percentage of rejected material. InSb semiconductor single crystals grown in different crystallographic directions by Czochralski’s method were used as an object of investigation. It has been shown that the complex of mechanical properties of a material (thick plates also characterize the properties of the ingot as a whole) is directly influenced by the direction of growth. In this case, the lowest resistance to brittle fracture is shown by plates with orientation (100). The influence of plate surface treatment on the complex of mechanical properties is illustrated by X‑ray mapping. It is also shown in the present study that the microhardness of InSb wafers exhibiting different resistance to brittle fracture can have close values ((100)[100]—183 ± 0.6 HV, (100)[112]—179 ± 0.7 HV). A possible option for upgrading the microhardness measurement method could be to evaluate the crack resistance of the material by analyzing the geometry of the indenter-formed cracks.

Abstract Image

取决于晶体取向和生长条件的单晶 InSb 强度特性研究
摘要 这项工作致力于研究 X 射线分析、光学显微镜和样品表面微硬度研究在估算单晶体复杂机械特性框架内的适用极限,这些特性在很大程度上决定了成品(晶片)的产量并形成其最终成本。GOST 规定的机械特性研究方法通常适用于金属和合金,不适用于半导体材料。因此,当务之急是开发一种方法来评估半导体晶片的抗脆性断裂能力,从而优化单晶生长的技术机制,降低最终废品率。研究对象是采用 Czochralski 方法在不同晶体学方向生长的 InSb 半导体单晶体。研究表明,材料的机械性能(厚板也是铸锭整体性能的特征)直接受生长方向的影响。在这种情况下,方向为 (100) 的厚板抗脆性断裂能力最低。板材表面处理对机械性能复合体的影响可通过 X 射线绘图来说明。本研究还表明,表现出不同抗脆性断裂能力的 InSb 硅片的显微硬度值很接近((100)[100]-183 ± 0.6 HV,(100)[112]-179 ± 0.7 HV)。提升显微硬度测量方法的一个可行方案是通过分析压头形成的裂纹的几何形状来评估材料的抗裂性。
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来源期刊
CiteScore
1.00
自引率
20.00%
发文量
170
审稿时长
10.5 months
期刊介绍: Journal of Communications Technology and Electronics is a journal that publishes articles on a broad spectrum of theoretical, fundamental, and applied issues of radio engineering, communication, and electron physics. It publishes original articles from the leading scientific and research centers. The journal covers all essential branches of electromagnetics, wave propagation theory, signal processing, transmission lines, telecommunications, physics of semiconductors, and physical processes in electron devices, as well as applications in biology, medicine, microelectronics, nanoelectronics, electron and ion emission, etc.
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