Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, C.R. Kao
{"title":"Experimental and thermodynamic assessment of the Cu–In system","authors":"Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, C.R. Kao","doi":"10.1016/j.calphad.2024.102700","DOIUrl":null,"url":null,"abstract":"<div><p>Owing to the low melting temperature and excellent mechanical properties, In is considered a potential low-temperature solder. However, the interfacial reaction between In and Cu substrates is still unclear, specifically regarding the stability of CuIn<sub>2</sub>. Although CuIn<sub>2</sub> was often observed at the Cu–In thin film after long-term aging below 100 °C, it is considered as a metastable phase and has not been added into the Cu–In phase diagram yet. In this study, the stability of CuIn<sub>2</sub> and the peritectoid reaction Cu<sub>11</sub>In<sub>9</sub> + In → CuIn<sub>2</sub> were established using the Cu/In diffusion couple, Cu–In alloy phase equilibria, and decomposition investigation of CuIn<sub>2</sub>. The peritectoid temperature was determined to be in the range of 110–105 °C. Finally, thermodynamic assessment was conducted based on the experimental data and the revised Cu–In phase diagram.</p></div>","PeriodicalId":9436,"journal":{"name":"Calphad-computer Coupling of Phase Diagrams and Thermochemistry","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Calphad-computer Coupling of Phase Diagrams and Thermochemistry","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0364591624000427","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Owing to the low melting temperature and excellent mechanical properties, In is considered a potential low-temperature solder. However, the interfacial reaction between In and Cu substrates is still unclear, specifically regarding the stability of CuIn2. Although CuIn2 was often observed at the Cu–In thin film after long-term aging below 100 °C, it is considered as a metastable phase and has not been added into the Cu–In phase diagram yet. In this study, the stability of CuIn2 and the peritectoid reaction Cu11In9 + In → CuIn2 were established using the Cu/In diffusion couple, Cu–In alloy phase equilibria, and decomposition investigation of CuIn2. The peritectoid temperature was determined to be in the range of 110–105 °C. Finally, thermodynamic assessment was conducted based on the experimental data and the revised Cu–In phase diagram.
期刊介绍：
The design of industrial processes requires reliable thermodynamic data. CALPHAD (Computer Coupling of Phase Diagrams and Thermochemistry) aims to promote computational thermodynamics through development of models to represent thermodynamic properties for various phases which permit prediction of properties of multicomponent systems from those of binary and ternary subsystems, critical assessment of data and their incorporation into self-consistent databases, development of software to optimize and derive thermodynamic parameters and the development and use of databanks for calculations to improve understanding of various industrial and technological processes. This work is disseminated through the CALPHAD journal and its annual conference.
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