RD50-MPW: a series of monolithic High Voltage CMOS pixel chips with high granularity and towards high radiation tolerance

C. Zhang, B. Pilsl, S. Powell, E. Vilella, S. Zhang, T. Bergauer, R. Casanova, C. Irmler, U. Kraemer, R. Marco-Hernandez, J. Mazorra de Cos, P. Sieberer, J. Sonneveld, H. Steininger
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Abstract

A series of monolithic High Voltage CMOS (HV-CMOS) pixel sensor prototypes have been developed by the CERN-RD50 CMOS working group for potential use in future high luminosity experiments. The aim is to further improve the performance of HV-CMOS sensors, especially in terms of pixel granularity, timing resolution and radiation tolerance. The evaluation of one of this series, RD50-MPW3, is presented in this contribution, including laboratory and test beam measurements. The design of the latest prototype, RD50-MPW4, which resolves issues found in RD50-MPW3 and implements further improvements, is described.
RD50-MPW:一系列单片式高压 CMOS 像素芯片,颗粒度高,辐射耐受性强
欧洲核子研究中心-RD50 CMOS 工作组已经开发出一系列单片高压 CMOS(HV-CMOS)像素传感器原型,可能用于未来的高亮度实验。其目的是进一步提高 HV-CMOS 传感器的性能,特别是在像素粒度、时间分辨率和辐射耐受性方面。本报告介绍了对其中一个系列 RD50-MPW3 的评估,包括实验室和测试光束测量。最新原型 RD50-MPW4 的设计解决了 RD50-MPW3 中发现的问题,并实现了进一步的改进。
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