Effect of the Energy Director Material on the Structure and Properties of Ultrasonic Welded Lap Joints of PEI Plates with CF Fabric/PEI Prepreg

Defang Tian, V. Alexenko, Sergey V. Panin, A. Bogdanov, D. Buslovich
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Abstract

To estimate the possibility of using both low-melting TecaPEI and neat PEI films as energy directors (EDs) for ultrasonic welding (USW) of carbon fiber (CF) fabric–polyetherimide (PEI) laminates, some patterns of structure formation and mechanical properties of their lap joints were investigated by varying the process parameters. The experiment was planned by the Taguchi method with the L9 orthogonal matrix. Based on the obtained results, USW parameters were optimized accounting for maintaining the structural integrity of the joined components and improving their functional characteristics. The use of the low-melting EDTecaPEI film enabled US-welding the laminates with minimal damage to the fusion zone, and the achieved lap shear strength (LSS) values of ~7.6 MPa were low. The use of EDSolverPEI excluded thermal degradation of the components as well as damage to the fusion zone, and improved LSS values to 21 MPa. With the use of digital image correlation (DIC) and computed tomography (CT) techniques, the structural factors affecting the deformation behavior of the USW lap joints were justified. A scheme was proposed that established the relationship between structural factors and the deformation response of the USW lap joints under static tension. The TecaPEI film can be used in USW procedures when very high interlayer adhesion properties are not on demand.
能量导向材料对带有 CF 纤维/PEI 预浸料的 PEI 板超声波焊接搭接接头的结构和性能的影响
为了评估使用低熔点 TecaPEI 和纯 PEI 薄膜作为碳纤维(CF)织物-聚醚酰亚胺(PEI)层压板超声波焊接(USW)的能量引导(ED)的可能性,我们通过改变工艺参数研究了其搭接接头的结构形成模式和机械性能。实验采用 L9 正交矩阵的田口方法进行规划。根据获得的结果,对 USW 参数进行了优化,以保持连接部件的结构完整性并改善其功能特性。低熔点 EDTecaPEI 薄膜的使用使 USW 焊接层压板时对熔合区的破坏最小,达到的搭接剪切强度(LSS)值较低,约为 7.6 兆帕。使用 EDSolverPEI 后,组件的热降解和熔合区的损坏均被排除,LSS 值提高到 21 兆帕。利用数字图像相关(DIC)和计算机断层扫描(CT)技术,对影响 USW 搭接接头变形行为的结构因素进行了论证。提出的方案确定了结构因素与 USW 搭接接头在静态拉力下的变形响应之间的关系。当不需要非常高的层间粘附性能时,TecaPEI 薄膜可用于 USW 过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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