Robust Control Chart Application in Semiconductor Manufacturing Process

Sufinah Dahari, Muzalwana Abdul Talib, Adilah Abdul Ghapor
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Abstract

Statistical Process Control (SPC) charts are frequently used in the semiconductor manufacturing environment to monitor process quality and detect special-cause variations, hence, to take corrective actions when necessary. The important aspects of control charts to consider on production floors are identifying the primary objective of implementing control charts, the type of data to monitor and the most appropriate control limits to establish. When the quality data is a type of attribute data like the proportion of defectives from a production lot, a p-chart approach is most suitable. In p-chart applications, although the assumption of normally distributed process data is not mandatory, the widespread practice is to assume the normal distribution of process data when establishing the control limits. Yet again, the reality of industrial settings is that process data are most likely influenced by outliers, resulting in highly skewed distributions. This paper addresses these issues by proposing robust SPC charting techniques to detect special-cause variations in the semiconductor manufacturing processes. Here, we present a case study of a semiconductor company in Malaysia, Dominant Opto Technologies Sdn. Bhd. to propose three robust statistical approaches for monitoring the proportion of defectives in production lots. We apply M-estimates, median, and interquartile range to calculate the upper control limits (UCL) and found that robust estimators are more effective in detecting early process deterioration and capturing the out-of-control (OOC) conditions better than traditional control charts. By proposing robust methods, this study enlightens the practical aspects of process quality improvement for real-life manufacturing setups. Because a high OOC rate may impact manufacturing productivity, we recommend the decision-makers choose the types of control charts based on the implications of each robust approach toward quality and productivity. The significance of this study includes providing insights into setting up the appropriate attribute control charts for detecting defective proportions for professionals and SPC researchers working in these areas.
稳健控制图在半导体制造过程中的应用
统计过程控制 (SPC) 控制图常用于半导体制造环境,以监控过程质量和检测特殊原因引起的变化,从而在必要时采取纠正措施。生产车间需要考虑的控制图的重要方面是确定实施控制图的主要目标、要监控的数据类型以及要建立的最合适的控制限值。如果质量数据是一种属性数据,如生产批次中的缺陷比例,则最适合采用 p 型图方法。在 p 型图应用中,虽然并不强制要求假定过程数据呈正态分布,但普遍的做法是在确定控制限值时假定过程数据呈正态分布。然而,工业环境的现实情况是,过程数据很可能受到异常值的影响,导致分布高度偏斜。本文针对这些问题,提出了稳健的 SPC 制图技术,以检测半导体制造过程中的特殊原因变异。在此,我们以马来西亚的一家半导体公司 Dominant Opto Technologies Sdn. Bhd 为案例,提出了三种用于监控生产批次中缺陷比例的稳健统计方法。我们应用 M 估计值、中位数和四分位数间范围来计算控制上限 (UCL),发现稳健估计值比传统控制图更能有效地检测早期流程恶化,并更好地捕捉失控 (OOC) 状况。通过提出稳健方法,本研究为现实生活中的生产设置提供了工艺质量改进的实践启示。由于高 OOC 率可能会影响生产率,我们建议决策者根据每种稳健方法对质量和生产率的影响来选择控制图的类型。本研究的意义在于为从事这些领域工作的专业人员和 SPC 研究人员提供了建立适当属性控制图以检测缺陷比例的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
1.30
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