Curing of epoxy adhesives between thin metal foils by means of inductive heating

IF 2.5 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications Pub Date : 2024-04-09 DOI:10.1177/14644207241245256

Vinzenz Ginster, Maximilian Klaus Heym, Christoph Jürgen Anton Beier, Maike Epperlein, Alexander Schiebahn, Uwe Reisgen

引用次数: 0

Abstract

Metal foils are being widely used, from the chemical or electronics sector to household appliances. The joining of these foils by adhesive bonding is often the preferred method due to discolouring and warping under the thermal stresses of other joining methods, such as welding. However, long curing times are a disadvantage of adhesive bonding compared to welding. The use of electromagnetic induction is a promising solution for accelerated curing. This work investigates induction heating for accelerated curing of 1-C epoxy adhesives for bonding of thin nickel foils. Process parameters for rapid curing of the adhesives were determined based on reaction kinetics using differential scanning calorimetry measurements. According to those results peel test specimens were fabricated, and the peel resistance was evaluated using a 90° peel load.

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通过感应加热固化薄金属箔之间的环氧树脂粘合剂

从化工或电子行业到家用电器，金属箔的应用非常广泛。由于在焊接等其他连接方法的热应力作用下会出现变色和翘曲，因此通过粘合剂粘接这些金属箔通常是首选方法。然而，与焊接相比，固化时间长是粘合剂粘接的一个缺点。使用电磁感应是一种很有前途的加速固化解决方案。这项工作研究了感应加热用于加速固化 1-C 环氧树脂粘合剂，以粘合薄镍箔。利用差示扫描量热仪测量反应动力学，确定了快速固化粘合剂的工艺参数。根据这些结果制作了剥离试样，并使用 90° 剥离负载评估了抗剥离性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 工程技术-材料科学：综合

CiteScore

4.70

自引率

8.30%

发文量

166

审稿时长

3 months

期刊介绍： The Journal of Materials: Design and Applications covers the usage and design of materials for application in an engineering context. The materials covered include metals, ceramics, and composites, as well as engineering polymers. "The Journal of Materials Design and Applications is dedicated to publishing papers of the highest quality, in a timely fashion, covering a variety of important areas in materials technology. The Journal''s publishers have a wealth of publishing expertise and ensure that authors are given exemplary service. Every attention is given to publishing the papers as quickly as possible. The Journal has an excellent international reputation, with a corresponding international Editorial Board from a large number of different materials areas and disciplines advising the Editor." Professor Bill Banks - University of Strathclyde, UK This journal is a member of the Committee on Publication Ethics (COPE).