Bonding Performance of Preservative-Treated Cross-Laminated Timber (CLT) Posttreated with CU-Based Preservatives

Abstract

To expand the use of cross-laminated timber (CLT) to exterior applications, there is a need to protect the panels from biodegrading agents such as fungi and termites. Pressure treatments are effective methods of increasing the durability of wood and wood-based products; however, studies on pressure-treated CLT are limited. In this study, preservative-treated CLT samples from prefabricated CLT panels were prepared and impregnated with Cu-based preservatives through a conventional vacuum-pressure process. The effects of panel layup (3-ply parallel, 3-ply perpendicular, and 5-ply parallel) and preservative treatment (untreated [control], copper azole-type C [CA-C], and micronized copper azole-type [MCA]) on the bonding performance were investigated. Panel layup and preservative treatment had a significant influence on the block shear strength and percentage of wood failure (WFP) of the treated panels. Overall, approximately 60 percent of the block shear specimens had a WFP of >75 percent. However, fewer than 10 percent of the delamination specimens met the ASTM D2559 (2018) limitation of 1 percent for softwood used in outdoor applications. ASTM D2559 counts shallow wood failure as delamination, which could have been a reason for the high delamination rate. The percentage of wood failure and the high rate of delamination could be due to the moisture-induced adhesion failure resulting from the pressure-treatment process. The preservative pressure-treatment of the CLT panels increased the moisture content (MC) from 12–15 percent to approximately 85 percent MC, and the severe swelling of the panels during treatment might have imposed a high stress on the bond line. However, no noticeable delamination of the panels was observed during the actual treating phase of the study. These results show the feasibility of treating prefabricated CLT panels with CA-C and MCA preservatives without compromising the bonding strength.