Mathematical Models of Local Heating of Elements of Electronic Devices

V. Havrysh
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Abstract

Linear and non-linear mathematical models for the determination of the temperature field, and subsequently for the analysis of temperature regimes in isotropic spatial heat-active media sub-jected to internal and external local heat load, have been developed. In the case of nonlinear boundary-value problems, the Kirchhoff transformation was applied, using which the original nonlinear heat conduction equations and nonlinear boundary conditions were linearized, and as a result, linearized second-order differential equations with partial derivatives and a discontinu-ous right-hand side and partially linearized boundary conditions were obtained. For the final linearization of the partially linearized differential equation and boundary conditions, the ap-proximation of the temperature according to one of the spatial coordinates on the boundary sur-faces of the inclusion was performed by piecewise constant functions. To solve linear bounda-ry-value problems, as well as obtained linearized boundary-value problems with respect to the Kirchhoff transformation, the Henkel integral transformation method was used, as a result of which analytical solutions of these problems were obtained. For a heat-sensitive environment, as an example, a linear dependence of the coefficient of thermal conductivity of the structural material of the structure on temperature, which is often used in many practical problems, was chosen. As a result, analytical relations for determining the temperature distribution in this envi-ronment were obtained. Numerical analysis of temperature behavior as a function of spatial co-ordinates for given values of geometric and thermophysical parameters was performed. The in-fluence of the power of internal heat sources and environmental materials on the temperature distribution was studied. To determine the numerical values of the temperature in the given structure, as well as to analyze the heat exchange processes in the middle of these structures, caused by the internal and external heat load, software tools were developed, using which a ge-ometric image of the temperature distribution depending on the spatial coordinates was made.
电子设备元件局部加热的数学模型
已开发出用于确定温度场的线性和非线性数学模型,以及随后用于分析各向同性空间热活性介质中受内部和外部局部热负荷影响的温度状态的数学模型。在非线性边界值问题中,应用了基尔霍夫变换,利用该变换将原始的非线性热传导方程和非线性边界条件线性化,从而得到了带有偏导数和不连续右边的线性化二阶微分方程以及部分线性化边界条件。在对部分线性化微分方程和边界条件进行最终线性化时,根据包含体边界表面上的一个空间坐标,通过分片常数函数对温度进行了近似。为了解决线性边界值问题,以及根据基尔霍夫变换得到的线性化边界值问题,使用了亨克尔积分变换方法,结果得到了这些问题的解析解。以热敏环境为例,选择了在许多实际问题中经常使用的结构材料导热系数与温度的线性关系。因此,获得了确定该环境中温度分布的分析关系。在给定几何和热物理参数值的情况下,对温度行为作为空间坐标的函数进行了数值分析。研究了内部热源功率和环境材料对温度分布的影响。为了确定给定结构中的温度数值,以及分析这些结构中间由内部和外部热负荷引起的热交换过程,开发了软件工具,利用这些工具制作了取决于空间坐标的温度分布几何图像。
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