Lead-Free Conductors with a Surface Treatment Ensuring a Low Melting Temperature

Q2 Engineering
A. Mareška, T. Kordová, Martin Havlík Míka
{"title":"Lead-Free Conductors with a Surface Treatment Ensuring a Low Melting Temperature","authors":"A. Mareška, T. Kordová, Martin Havlík Míka","doi":"10.3311/pptr.22876","DOIUrl":null,"url":null,"abstract":"In order to protect the environment and to ensure sustainability, it is prohibited to use lead materials in the production of automotive components. As part of soldering, busbars are used that usually have a copper core and a coating made of tin, but the melting point of such material is high, which poses a problem during soldering. This article discusses the case where a busbar is interconnected with another conductor in a sealable pressure vessel where high temperatures and pressures are reached. The product is heated to a certain temperature and the melting temperature of the given bus coating is exceeded, resulting in soldering and an ideal connection of the wires. The problem is that the temperatures reached by the processor during this operation are lower than the melting temperatures of the busbar with a tin coating. In the article, the authors focus on the production and development of new types of busbars with a coating consisting of tin, bismuth and indium and discuss possible formulations and their effect on the melting temperature of the busbars.","PeriodicalId":39536,"journal":{"name":"Periodica Polytechnica Transportation Engineering","volume":"525 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Periodica Polytechnica Transportation Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3311/pptr.22876","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

Abstract

In order to protect the environment and to ensure sustainability, it is prohibited to use lead materials in the production of automotive components. As part of soldering, busbars are used that usually have a copper core and a coating made of tin, but the melting point of such material is high, which poses a problem during soldering. This article discusses the case where a busbar is interconnected with another conductor in a sealable pressure vessel where high temperatures and pressures are reached. The product is heated to a certain temperature and the melting temperature of the given bus coating is exceeded, resulting in soldering and an ideal connection of the wires. The problem is that the temperatures reached by the processor during this operation are lower than the melting temperatures of the busbar with a tin coating. In the article, the authors focus on the production and development of new types of busbars with a coating consisting of tin, bismuth and indium and discuss possible formulations and their effect on the melting temperature of the busbars.
表面处理可确保低熔化温度的无铅导体
为了保护环境和确保可持续发展,在生产汽车零部件时禁止使用含铅材料。作为焊接的一部分,使用的母线通常具有铜芯和锡涂层,但这种材料的熔点很高,在焊接过程中会产生问题。本文讨论的是在高温高压的可密封压力容器中母线与另一导体互连的情况。产品加热到一定温度后,特定母线涂层的熔化温度会被超过,从而导致焊接和导线的理想连接。问题在于,处理器在此操作过程中达到的温度低于锡涂层母线的熔化温度。在这篇文章中,作者重点讨论了生产和开发新型锡、铋和铟涂层母线的问题,并讨论了可能的配方及其对母线熔化温度的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Periodica Polytechnica Transportation Engineering
Periodica Polytechnica Transportation Engineering Engineering-Automotive Engineering
CiteScore
2.60
自引率
0.00%
发文量
47
期刊介绍: Periodica Polytechnica is a publisher of the Budapest University of Technology and Economics. It publishes seven international journals (Architecture, Chemical Engineering, Civil Engineering, Electrical Engineering, Mechanical Engineering, Social and Management Sciences, Transportation Engineering). The journals have free electronic versions.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信