Bias voltage influence on the a-SiCx:H interlayer deposition using tetramethylsilane: Decorative applications of a-C:H thin films on steel

M. Goldbeck, V. Piroli, J. S. Weber, C. D. Boeira, B. L. Perotti, N. K. Fukumasu, Fernando Alvarez, C. A. Figueroa, A. F. Michels
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Abstract

Hydrogenated amorphous carbon (a-C:H) is a type of coating vastly applied on steel alloys due to its low friction coefficient, high hardness, and chemical inertness. Also, its characteristic brilliant black color like onyx stone is desirable for decorative applications. Despite the beneficial properties conferred to ferrous substrates, the adhesion of a-C:H films is weakened by its residual stress. In order to improve the adhesion of a-C:H films/steel alloy structures, one adopted strategy is the addition of an interlayer. This research investigated the influence of the bias voltage applied on the deposition of hydrogenated amorphous silicon carbide (a-SiCx:H) interlayers, with tetramethylsilane (TMS) as the precursor, to promote adhesion in a-C:H/a-SiCx:H/ferrous alloy structures for decorative applications. The thicker interlayer was achieved at −600 V. Two regimes were proposed to explain this behavior considering ionization rates and resputtering rates and chemical reactions in plasma. The chemical structure in different regions of the a-SiCx:H interlayer was analyzed in detail. An increase in the applied bias voltage leads to oxygen incorporation at the a-C:H/a-SiCx:H interface. Higher bias voltages result in lower silicon content at the a-SiCx:H/steel interface, which is correlated to the −800 V sample’s poor adhesion. Finally, we have included a discussion about a new range of loads when a decorative piece is held by the hand where the critical loads for delamination of a-C:H coatings measured here are good enough for decorative applications.
偏置电压对使用四甲基硅烷的 a-SiCx:H 层间沉积的影响:a-C:H 薄膜在钢铁上的装饰应用
氢化无定形碳(a-C:H)具有低摩擦系数、高硬度和化学惰性,是一种广泛应用于钢合金的涂层。此外,它像玛瑙石一样亮丽的黑色也是理想的装饰材料。尽管 a-C:H 薄膜具有对黑色基材有利的特性,但其残余应力会削弱其附着力。为了提高 a-C:H 薄膜/钢合金结构的附着力,采用的一种策略是添加中间膜。本研究调查了偏置电压对以四甲基硅烷(TMS)为前驱体的氢化无定形碳化硅(a-SiCx:H)中间膜沉积的影响,以促进装饰应用中 a-C:H/a-SiCx:H/ 铁合金结构的附着力。在-600 V电压下实现了较厚的夹层。考虑到等离子体中的电离率、重溅射率和化学反应,提出了两种机制来解释这种行为。对 a-SiCx:H 夹层不同区域的化学结构进行了详细分析。外加偏置电压的增加会导致氧在 a-C:H/a-SiCx:H 界面的掺入。偏置电压越高,a-SiCx:H/钢界面上的硅含量越低,这与-800 V样品的粘附性差有关。最后,我们还讨论了手持装饰件时的新负载范围,这里测得的 a-C:H 涂层脱层临界负载足以满足装饰应用的要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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