Mikko Karppinen, Mikko T. Harjanne, Noora Heinilehto, Jae-Wung Lee, J. Ollila, Jaska Paaso
{"title":"Chip-scale hermetic packaging of Si PIC with high-speed electronics and photonics","authors":"Mikko Karppinen, Mikko T. Harjanne, Noora Heinilehto, Jae-Wung Lee, J. Ollila, Jaska Paaso","doi":"10.1117/12.3006559","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":517898,"journal":{"name":"Optical Interconnects XXIV","volume":"30 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Interconnects XXIV","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.3006559","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}