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FR4, flex-PCB, and SiP processing performed with speed and quality using high-power visible and UV nanosecond lasers

Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX Pub Date : 2024-03-13 DOI:10.1117/12.3003477
Terence Hollister, James M. Bovatsek
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使用大功率可见光和紫外纳秒激光器快速、高质量地完成 FR4、柔性 PCB 和 SiP 加工
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX
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