Investigation of Copper Codeposits with SiC Nano from Ionic Liquid (Ethaline) as Function of Concentration and Micro Particles Sizes where the Working Electrode in ‘Vertical’ Position Using Acoustic Impedance Electrochemical Quartz Crystal Microbalance (EQCM)

K. E. Ttaib, A. Benhmid
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Abstract

The gravimetric inspection of co-electrodeposited copper, with hard inert second phase ceramics SiC and 0.02 M [CuCl2.2H2O] in 1 ChCl: 2 EG, based liquid for different solution-phase loadings of 1-3 \(\mu\)m silicon carbide unpolished gold AT cut working electrode placed in’Vertical’ position, revealed that the EQCM method admits the first in-situ quantification or particulate inclusion.  It was found that the composition of incorporated substance was fairly dependant on the concentration of second phase particles in solution, where in this study the 5% SiC has the amount in the copper which is in a good agreement with alumina particles with the same size.  Another observation was that most of the material was drawn onto the surface rather than settling on to it, however the distribution of the hard phase was found to be reasonably even throughout the coating.  This technology is important because it assists deposition of bright copper coatings without adding hazard materials, such as cyanide. On the other hand the comparison between concentrations of  0.02 M  and 0.2 M [CuCl2.2H2O] in 1 ChCl: 2 EG based liquid for 10% solution-phase loadings of 45-55 nm size silicon carbide was also investigated, where the working electrode is placed in’Horizontal’  postion. It is very interisting that the experimental result showed that the mass loaded by 0.2 M solution is about 10 times greater than for the mass loaded by 0.02 M solution.
利用声阻抗电化学石英晶体微天平 (EQCM) 研究离子液体(乙碱)中铜与纳米碳化硅的共沉积物在工作电极处于 "垂直 "位置时的浓度和微粒尺寸的函数关系
对放置在 "垂直 "位置的 1-3 \(\mu\)m 碳化硅未抛光金 AT 切削工作电极的不同溶液相负载、在 1 ChCl: 2 EG 基液体中与硬质惰性第二相陶瓷 SiC 和 0.02 M [CuCl2.2H2O]共电解沉积铜的重量检测显示,EQCM 方法首次实现了原位定量或微粒掺杂。 在本研究中,5% 碳化硅在铜中的含量与相同大小的氧化铝颗粒相当。 另一个观察结果是,大部分材料都被吸附在表面上,而不是沉淀在表面上,但在整个涂层中,硬质相的分布相当均匀。 这项技术非常重要,因为它可以在不添加氰化物等危险材料的情况下帮助沉积光亮的铜涂层。另一方面,还研究了在 1 ChCl: 2 EG 基液体中 0.02 M 和 0.2 M [CuCl2.2H2O]浓度与 45-55 nm 尺寸碳化硅 10%溶液相负载的比较,其中工作电极处于 "水平 "位置。实验结果表明,0.2 M 溶液的负载质量是 0.02 M 溶液负载质量的 10 倍。
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