Design of Dry Friction Damper to Reduce Vibration Impacts to Circuit Cards at Critical Frequencies

Ihor Kovtun, Andrii Goroshko, Svitlana Petrashchuk
{"title":"Design of Dry Friction Damper to Reduce Vibration Impacts to Circuit Cards at Critical Frequencies","authors":"Ihor Kovtun, Andrii Goroshko, Svitlana Petrashchuk","doi":"10.12913/22998624/184026","DOIUrl":null,"url":null,"abstract":"The paper is focused on providing strength and stiffness for circuit cards exposed to vibration at critical frequen - cies. Since the dry friction damping is more effective than viscous damping and in case when application of vis - cous dampers is restricted by electronic package design the dry friction damper is proposed to be embedded to de-sign of enclosure case in order to reduce oscillation amplitudes of circuit cards at critical frequencies. Dry friction damper produces dissipative forces – non-elastic resistance forces due to friction in kinematic pairs undergoing oscillations. The mathematical model has been developed for estimation of maximal dynamic stress and deflec - tion in critical cross-section of circuit card with embedded dry friction damper at critical frequencies. Developed mathematical model specifies minimal limit value for stiffness of dry friction damper, which is used in engineering calculations to determine its geometric parameters. Design of dry friction damper is introduced by semi-elliptical beam with rectangular profile. The effectiveness of dry friction damper to reduce dynamic stress and deflection in circuit cards has been analytically proved and experimentally testified.","PeriodicalId":517116,"journal":{"name":"Advances in Science and Technology Research Journal","volume":"10 4","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Science and Technology Research Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.12913/22998624/184026","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The paper is focused on providing strength and stiffness for circuit cards exposed to vibration at critical frequen - cies. Since the dry friction damping is more effective than viscous damping and in case when application of vis - cous dampers is restricted by electronic package design the dry friction damper is proposed to be embedded to de-sign of enclosure case in order to reduce oscillation amplitudes of circuit cards at critical frequencies. Dry friction damper produces dissipative forces – non-elastic resistance forces due to friction in kinematic pairs undergoing oscillations. The mathematical model has been developed for estimation of maximal dynamic stress and deflec - tion in critical cross-section of circuit card with embedded dry friction damper at critical frequencies. Developed mathematical model specifies minimal limit value for stiffness of dry friction damper, which is used in engineering calculations to determine its geometric parameters. Design of dry friction damper is introduced by semi-elliptical beam with rectangular profile. The effectiveness of dry friction damper to reduce dynamic stress and deflection in circuit cards has been analytically proved and experimentally testified.
设计干摩擦阻尼器以减少临界频率对电路板的振动影响
本文的重点是为暴露在临界频率振动下的电路板提供强度和刚度。由于干摩擦阻尼比粘滞阻尼更有效,而且当粘滞阻尼器的应用受到电子封装设计的限制时,建议将干摩擦阻尼器嵌入外壳的去设计中,以降低电路卡在临界频率下的振幅。干摩擦阻尼器会产生耗散力--由于运动对在振荡过程中产生摩擦而产生的非弹性阻力。为估算内嵌干摩擦阻尼器的电路卡临界截面在临界频率下的最大动态应力和变形,我们开发了一个数学模型。所开发的数学模型规定了干摩擦阻尼器刚度的最小极限值,用于工程计算以确定其几何参数。干摩擦阻尼器的设计由带有矩形轮廓的半椭圆形梁引入。干摩擦阻尼器在减少电路卡动态应力和挠度方面的有效性已得到分析证明和实验验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信