Characterization of Electrical Tree Degradation of Epoxy Resin under Thermal and Temperature Stresses by Photoelastic Effect

Q1 Engineering
Hein Htet Aung;Yuhuai Wang;Jin Li;Ying Zhang;Tatsuo Takada
{"title":"Characterization of Electrical Tree Degradation of Epoxy Resin under Thermal and Temperature Stresses by Photoelastic Effect","authors":"Hein Htet Aung;Yuhuai Wang;Jin Li;Ying Zhang;Tatsuo Takada","doi":"10.23919/CJEE.2023.000047","DOIUrl":null,"url":null,"abstract":"Epoxy resin is widely used in the support, insulation, and packaging components of electrical equipment owing to their excellent insulation, thermal, and mechanical properties. However, epoxy-resin insulation often suffers from thermal and mechanical stresses under extreme environmental conditions and a compact design, which can induce electrical tree degradation and insulation failure in electrical equipment. In this study, the photoelastic method is employed to investigate the thermal-mechanical coupling stress dependence of the electrical treeing behavior of epoxy resin. Typical electrical tree growth morphology and stress distribution were observed using the photoelastic method. The correlation between the tree length and overall accumulated damage with an increase in mechanical stress is determined. The results show that compressive stress retards the growth of electrical trees along the electric field, while tensile stress has accelerating effects. This proves that the presence of thermal stress can induce more severe accumulated damage.","PeriodicalId":36428,"journal":{"name":"Chinese Journal of Electrical Engineering","volume":"10 1","pages":"12-20"},"PeriodicalIF":0.0000,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10490171","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chinese Journal of Electrical Engineering","FirstCategoryId":"1087","ListUrlMain":"https://ieeexplore.ieee.org/document/10490171/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

Abstract

Epoxy resin is widely used in the support, insulation, and packaging components of electrical equipment owing to their excellent insulation, thermal, and mechanical properties. However, epoxy-resin insulation often suffers from thermal and mechanical stresses under extreme environmental conditions and a compact design, which can induce electrical tree degradation and insulation failure in electrical equipment. In this study, the photoelastic method is employed to investigate the thermal-mechanical coupling stress dependence of the electrical treeing behavior of epoxy resin. Typical electrical tree growth morphology and stress distribution were observed using the photoelastic method. The correlation between the tree length and overall accumulated damage with an increase in mechanical stress is determined. The results show that compressive stress retards the growth of electrical trees along the electric field, while tensile stress has accelerating effects. This proves that the presence of thermal stress can induce more severe accumulated damage.
利用光弹性效应表征环氧树脂在热应力和温度应力下的电树降解特性
环氧树脂具有优异的绝缘、热和机械性能,因此被广泛应用于电气设备的支撑、绝缘和包装部件。然而,环氧树脂绝缘材料在极端的环境条件和紧凑的设计下往往会受到热应力和机械应力的影响,从而导致电气设备的电树退化和绝缘失效。本研究采用光弹性方法研究了环氧树脂电气树化行为的热机械耦合应力依赖性。利用光弹性方法观察了典型的电气树生长形态和应力分布。确定了机械应力增加时树长度和整体累积损伤之间的相关性。结果表明,压应力会延缓电树沿电场的生长,而拉应力则会加速电树的生长。这证明热应力的存在会导致更严重的累积损伤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Chinese Journal of Electrical Engineering
Chinese Journal of Electrical Engineering Energy-Energy Engineering and Power Technology
CiteScore
7.80
自引率
0.00%
发文量
621
审稿时长
12 weeks
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