Growth paths in polycrystalline thin films

IF 1.9 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Modelling and Simulation in Materials Science and Engineering Pub Date : 2024-02-29 DOI:10.1088/1361-651x/ad2af4

D Zöllner

引用次数: 0

Abstract

The polycrystalline grain microstructure of metallic thin films coarsens during grain growth in a unique way when the initial grain structure contains multiple grains in the film thickness. A regime with fast coarsening is followed by a regime of slow coarsening. At the same time, the grain structure itself undergoes clear structural changes from a bulk-like to a bamboo-like structure. The overall coarsening process evolves continuously, whereas the growth paths of individual grains do not follow the ones observed and predicted in either two- or three-dimensional grain growth.

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多晶薄膜的生长路径

当初始晶粒结构在薄膜厚度上包含多个晶粒时，金属薄膜的多晶晶粒微观结构会在晶粒生长过程中以一种独特的方式粗化。快速粗化过程之后是缓慢粗化过程。与此同时，晶粒结构本身也发生了明显的结构变化，从块状结构变为竹节状结构。整体粗化过程持续演化，而单个晶粒的生长路径并不遵循在二维或三维晶粒生长过程中观察到和预测到的路径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Modelling and Simulation in Materials Science and Engineering 工程技术-材料科学：综合

CiteScore

3.30

自引率

5.60%

发文量

审稿时长

1.7 months

期刊介绍： Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation. Subject coverage: Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.