Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture

IF 2.9 3区 工程技术 Q2 AUTOMATION & CONTROL SYSTEMS
{"title":"Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture","authors":"","doi":"10.1007/s00170-024-13490-2","DOIUrl":null,"url":null,"abstract":"<h3>Abstract</h3> <p>Ultrasonic additive manufacturing (UAM) is an advanced joining technique that utilizes ultrasonic vibrations to bond layers of metal foil together. UAM offers several benefits over traditional manufacturing methods, including enhanced design flexibility and reduced material waste, and its potential applications in various industries such as aerospace, automotive, and biomedical engineering are being actively explored. The study employs a nanoindentation apparatus to investigate the effect of the UAM process on the local mechanical properties of the bonded interface, along with changes in microstructure, which were investigated using scanning electron microscopy and electron back-scattered diffraction. The results revealed a significant correlation between material hardness and local plasticity. EBSD has revealed that the grain size distribution of Al far from the interface contains 57% of the grains less than 3 µm in size, while at the interface this number rises to approximately 78%, indicating that the average grain size decreases as it approaches the interface. This result is consistent with nanoindentation results that demonstrated a gradual change in the hardness of Al foil far from the interface to close to the interface (the maximum penetration depth near the interface was 500 nm less than far from the interface). Both EBSD and nanoindentation disclose the effect of work hardening close to the interface, which is related to dislocation accumulation with a density of <span> <span>\\(8.6\\times {10}^{-10} {{\\text{cm}}}^{-2}\\)</span> </span> beneath the interface. The consistency of hardness and Young’s modulus with the pole figures and microscopic images demonstrated that plasticity flow and fine grain distribution would only occur in the vicinity of the interface in the softer metal region. Although the harder metal did not exhibit plasticity or recrystallization, the hardness, and Young’s modulus map indicated the formation of a layer of small grains close to the interface on the aluminum side owing to strain hardening and dynamic recrystallization.</p>","PeriodicalId":50345,"journal":{"name":"International Journal of Advanced Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Advanced Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s00170-024-13490-2","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
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Abstract

Ultrasonic additive manufacturing (UAM) is an advanced joining technique that utilizes ultrasonic vibrations to bond layers of metal foil together. UAM offers several benefits over traditional manufacturing methods, including enhanced design flexibility and reduced material waste, and its potential applications in various industries such as aerospace, automotive, and biomedical engineering are being actively explored. The study employs a nanoindentation apparatus to investigate the effect of the UAM process on the local mechanical properties of the bonded interface, along with changes in microstructure, which were investigated using scanning electron microscopy and electron back-scattered diffraction. The results revealed a significant correlation between material hardness and local plasticity. EBSD has revealed that the grain size distribution of Al far from the interface contains 57% of the grains less than 3 µm in size, while at the interface this number rises to approximately 78%, indicating that the average grain size decreases as it approaches the interface. This result is consistent with nanoindentation results that demonstrated a gradual change in the hardness of Al foil far from the interface to close to the interface (the maximum penetration depth near the interface was 500 nm less than far from the interface). Both EBSD and nanoindentation disclose the effect of work hardening close to the interface, which is related to dislocation accumulation with a density of \(8.6\times {10}^{-10} {{\text{cm}}}^{-2}\) beneath the interface. The consistency of hardness and Young’s modulus with the pole figures and microscopic images demonstrated that plasticity flow and fine grain distribution would only occur in the vicinity of the interface in the softer metal region. Although the harder metal did not exhibit plasticity or recrystallization, the hardness, and Young’s modulus map indicated the formation of a layer of small grains close to the interface on the aluminum side owing to strain hardening and dynamic recrystallization.

铝/铜的多层固态超声增材制造:局部特性和纹理
摘要 超声波增材制造(UAM)是一种先进的连接技术,它利用超声波振动将金属箔层粘合在一起。与传统制造方法相比,UAM 具有多种优势,包括提高设计灵活性和减少材料浪费,目前正在积极探索其在航空航天、汽车和生物医学工程等各个行业的潜在应用。本研究采用纳米压痕仪研究了 UAM 工艺对粘合界面局部机械性能的影响以及微观结构的变化,并使用扫描电子显微镜和电子反向散射衍射进行了研究。结果表明,材料硬度和局部塑性之间存在明显的相关性。EBSD 显示,在远离界面的铝晶粒尺寸分布中,有 57% 的晶粒尺寸小于 3 µm,而在界面处,这一数字上升到约 78%,表明平均晶粒尺寸随着接近界面而减小。这一结果与纳米压痕测试结果一致,后者表明铝箔的硬度从远离界面逐渐向靠近界面的方向变化(靠近界面的最大穿透深度比远离界面的小 500 nm)。EBSD 和纳米压痕都揭示了靠近界面处加工硬化的影响,这与界面下方密度为 \(8.6\times {10}^{-10} {{text{cm}}}^{-2}\) 的位错堆积有关。硬度和杨氏模量与极值图和显微图像的一致性表明,塑性流动和细晶粒分布只会发生在较软金属区域的界面附近。虽然较硬的金属没有表现出塑性或再结晶,但硬度和杨氏模量图显示,由于应变硬化和动态再结晶,在铝侧界面附近形成了一层小晶粒层。
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来源期刊
CiteScore
5.70
自引率
17.60%
发文量
2008
审稿时长
62 days
期刊介绍: The International Journal of Advanced Manufacturing Technology bridges the gap between pure research journals and the more practical publications on advanced manufacturing and systems. It therefore provides an outstanding forum for papers covering applications-based research topics relevant to manufacturing processes, machines and process integration.
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