Liquid metal phase change materials for thermal management of electronics

IF 7.7 2区物理与天体物理 Q1 PHYSICS, MULTIDISCIPLINARY

Advances in Physics: X Pub Date : 2024-03-11 DOI:10.1080/23746149.2024.2324910

Yuchen Yao, Wei Li, Jing Liu, Zhongshan Deng

引用次数: 0

Abstract

With the rapid development of various chips towards high performance and integration, the ‘thermal barrier’ difficulty facing electronic devices has become ever increasingly challenging, while at t...

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用于电子设备热管理的液态金属相变材料

随着各种芯片向高性能和集成化方向的快速发展，电子设备所面临的 "热障 "难题变得越来越具有挑战性，而与此同时，...

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来源期刊

Advances in Physics: X Physics and Astronomy-General Physics and Astronomy

CiteScore

13.60

自引率

0.00%

发文量

审稿时长

13 weeks

期刊介绍： Advances in Physics: X is a fully open-access journal that promotes the centrality of physics and physical measurement to modern science and technology. Advances in Physics: X aims to demonstrate the interconnectivity of physics, meaning the intellectual relationships that exist between one branch of physics and another, as well as the influence of physics across (hence the “X”) traditional boundaries into other disciplines including: Chemistry Materials Science Engineering Biology Medicine