The Influence of Corrosion Dissolution of the Metal Surface Layer on the Stress Concentration Factor in Butt-Welded Joins

IF 0.7 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Science Pub Date : 2024-03-11 DOI:10.1007/s11003-024-00775-w

A. V. Moltasov, A. V. Klymenko

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Abstract

The dissolution of the metal surface layer of butt-welded joints samples made of 09G2S steel by the anodic-cathodic process in the electrolyte, as a result of which the geometric parameters of the welded joint changed, was studied. For example, after corrosion tests the radius of transition from the weld metal to the base metal on the facial side of the joint increased from 3.07 to 3.88 mm, and on its root, side increased from 2.16 to 3.09 mm. Changes in the geometrical parameters of a welded joint affect the value of the stress concentration factors (SCF), which determine fatigue life of the welded joints Therefore, analytical calculations of the SCF in the sample of the 09G2S steel butt-weld before and after dissolution of the metal surface layer were performed. In this case, the existing formula for SCF determination on the root side of the joint was modified for the case when the bases of facial and root reinforcements were close enough. It was found that after corrosion dissolution of the metal surface layer, the maximum value of the SCF in the specimen decreased from 1.87 to 1.67.

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金属表层腐蚀溶解对对接焊接接头应力集中系数的影响

研究了 09G2S 钢对接焊接接头样品的金属表层在电解液中的阳极-阴极过程中的溶解情况，其结果是焊接接头的几何参数发生了变化。例如，经过腐蚀试验后，焊点正面从焊接金属到母材金属的过渡半径从 3.07 毫米增加到 3.88 毫米，根部从 2.16 毫米增加到 3.09 毫米。焊接接头几何参数的变化会影响应力集中系数（SCF）值，而应力集中系数决定了焊接接头的疲劳寿命。因此，我们对 09G2S 钢对接焊缝样品在金属表层溶解前后的 SCF 值进行了分析计算。在这种情况下，对现有的接头根部 SCF 测定公式进行了修改，以适用于表面和根部加固层基底足够接近的情况。结果发现，金属表层腐蚀溶解后，试样中 SCF 的最大值从 1.87 降至 1.67。

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来源期刊

Materials Science 工程技术-材料科学：综合

CiteScore

1.60

自引率

44.40%

发文量

审稿时长

4-8 weeks

期刊介绍： Materials Science reports on current research into such problems as cracking, fatigue and fracture, especially in active environments as well as corrosion and anticorrosion protection of structural metallic and polymer materials, and the development of new materials.