Skew Ornstein–Uhlenbeck processes with sticky reflection and their applications to bond pricing

IF 0.7 4区 数学 Q3 STATISTICS & PROBABILITY
Shiyu Song, Guangli Xu
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引用次数: 0

Abstract

We study a skew Ornstein–Uhlenbeck process with zero being a sticky reflecting boundary, which is defined as the weak solution to a stochastic differential equation (SDE) system involving local time. The main results obtained include: (i) the existence and uniqueness of solutions to the SDE system, (ii) the scale function and speed measure, and (iii) the distributional properties regarding the transition density and the first hitting times. On the application side, we apply the process to interest rate modeling and obtain the explicit pricing formula for zero-coupon bonds. Numerical examples illustrate the impacts on bond yields of skewness and stickiness parameters.

具有粘性反射的倾斜奥恩斯坦-乌伦贝克过程及其在债券定价中的应用
我们研究了一个倾斜的奥恩斯坦-乌伦贝克过程,其零点是一个粘性反射边界,它被定义为一个涉及局部时间的随机微分方程(SDE)系统的弱解。获得的主要结果包括(i) SDE 系统解的存在性和唯一性,(ii) 标度函数和速度度量,以及 (iii) 有关过渡密度和首次命中时间的分布特性。在应用方面,我们将该过程应用于利率建模,并获得了零息债券的显式定价公式。数值示例说明了偏度和粘性参数对债券收益率的影响。
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来源期刊
Journal of Applied Probability
Journal of Applied Probability 数学-统计学与概率论
CiteScore
1.50
自引率
10.00%
发文量
92
审稿时长
6-12 weeks
期刊介绍: Journal of Applied Probability is the oldest journal devoted to the publication of research in the field of applied probability. It is an international journal published by the Applied Probability Trust, and it serves as a companion publication to the Advances in Applied Probability. Its wide audience includes leading researchers across the entire spectrum of applied probability, including biosciences applications, operations research, telecommunications, computer science, engineering, epidemiology, financial mathematics, the physical and social sciences, and any field where stochastic modeling is used. A submission to Applied Probability represents a submission that may, at the Editor-in-Chief’s discretion, appear in either the Journal of Applied Probability or the Advances in Applied Probability. Typically, shorter papers appear in the Journal, with longer contributions appearing in the Advances.
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