Influence of transient heat pulse on heat transfer performance of vapor chamber with different filling ratios

IF 16.4 1区 化学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Zhou Wang, Li Jia, Hongling Lu, Yutong Shen, Liaofei Yin
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Abstract

Due to the different application for portable electronic devices, there are instantaneous changes in the thermal load of the CPU and battery in the operation. The traditional uniform structure wick can not allow for evaporation and reflow of the working fluid under complex conditions, hence reducing the heat transfer performance of the vapor chamber (VC). This paper puts forward a novel style of VC to overcome the difficulty of heat export for electronic devices with dual heat sources. The wick with gradient structure in heat source zone and reflow zone was made by the method of zonal sintering, which could effectively promote the evaporation and reflow of working fluid with multi-heating sources and complex conditions. The influence of step heating condition and pulse heating condition on the heat transfer performance of the VC with various filling ratios was analyzed. The results showed that under the step heating condition, the best heat transfer performance of the VC was achieved at a filling ratio of approximately 90%, with a minimum thermal resistance of only 0.31 oC/W at 45 W. Under the pulse heating condition, in order to significantly reduce the temperature hysteretic effect of the VC, a gradient structure core was sintered in different regions, and the maximum hysteretic temperature was 2.7 oC when the filling ratio wass 80% and 100%. The temperature lag could be effectively eliminated when the filling ratio was 90%. The results of the research supplied a theoretical basis for the design and testing of VC under complex working conditions and the development of efficient heat transfer elements.
瞬态热脉冲对不同填充比蒸发室传热性能的影响
由于便携式电子设备的应用不同,CPU 和电池的热负荷在运行过程中会发生瞬时变化。传统的均匀结构灯芯无法实现工作流体在复杂条件下的蒸发和回流,从而降低了蒸发腔(VC)的传热性能。本文提出了一种新型的气室,以克服双热源电子设备热量输出的困难。通过分区烧结的方法,在热源区和回流区制作了具有梯度结构的灯芯,可有效促进多热源和复杂条件下工作流体的蒸发和回流。分析了阶跃加热条件和脉冲加热条件对不同填充比 VC 传热性能的影响。结果表明,在阶跃加热条件下,填充率约为 90% 时 VC 的传热性能最佳,45 W 时的热阻最小仅为 0.31 oC/W。在脉冲加热条件下,为了显著降低 VC 的温度滞后效应,在不同区域烧结了梯度结构芯材,当填充率为 80% 和 100% 时,最大滞后温度为 2.7 oC。当填充率为 90% 时,可以有效消除温度滞后现象。研究结果为在复杂工作条件下设计和测试 VC 以及开发高效传热元件提供了理论依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Accounts of Chemical Research
Accounts of Chemical Research 化学-化学综合
CiteScore
31.40
自引率
1.10%
发文量
312
审稿时长
2 months
期刊介绍: Accounts of Chemical Research presents short, concise and critical articles offering easy-to-read overviews of basic research and applications in all areas of chemistry and biochemistry. These short reviews focus on research from the author’s own laboratory and are designed to teach the reader about a research project. In addition, Accounts of Chemical Research publishes commentaries that give an informed opinion on a current research problem. Special Issues online are devoted to a single topic of unusual activity and significance. Accounts of Chemical Research replaces the traditional article abstract with an article "Conspectus." These entries synopsize the research affording the reader a closer look at the content and significance of an article. Through this provision of a more detailed description of the article contents, the Conspectus enhances the article's discoverability by search engines and the exposure for the research.
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