TechRxiv

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
{"title":"TechRxiv","authors":"","doi":"10.1109/MEI.2024.10444741","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 2","pages":"1-1"},"PeriodicalIF":2.6000,"publicationDate":"2024-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10444741","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electrical Insulation Magazine","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10444741/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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TechRxiv
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来源期刊
IEEE Electrical Insulation Magazine
IEEE Electrical Insulation Magazine 工程技术-工程:电子与电气
CiteScore
4.60
自引率
3.40%
发文量
121
审稿时长
>12 weeks
期刊介绍: The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.
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