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System for detecting adhesive overflow in sensor chips based on improved Unet

International Conference on Optoelectronic Materials and Devices (ICOMD 2023) Pub Date : 2024-02-08 DOI:10.1117/12.3025172
Le Chen, Zourong Long, Bin Tang, Mingfu Zhao, Siyu Lei, Yulong He, Fuping Wei
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基于改进型 Unet 的传感器芯片溢胶检测系统
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来源期刊
International Conference on Optoelectronic Materials and Devices (ICOMD 2023)
International Conference on Optoelectronic Materials and Devices (ICOMD 2023)
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